Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing

Press Release | February 2, 2026
Press Release
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
 
 
 

New PCMPSolv™ clean for ceria applications delivers in situ cleaning
for advanced‑node performance and improved efficiency

 

WILMINGTON, Del., Feb 2, 2026 Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications. The new formulation, PCMPSolv™ PCMP2310 clean, is engineered to support advanced semiconductor manufacturing while enhancing sustainability across fab operations.

“As semiconductor devices continue to shrink and architectures become more complex, our customers require solutions that push the boundaries of innovation,” said Randal King, Chief Technology and Sustainability Officer at Qnity. “Qnity’s newest PCMPSolv™ solution helps fabs achieve the ultra-clean wafer surfaces essential for advanced-node performance. We’re proud to be powering today’s most advanced PCMP cleaning while promoting sustainability through operational efficiency.”

About PCMPSolv™ PCMP2310 PCMP clean

PCMPSolv™ PCMP2310 introduces a new standard for ceria PCMP cleaning by integrating the cleaning process directly inside the CMP tool. This in situ approach eliminates the need for traditional ex situ sulfuric acid peroxide mixture (SPM) steps, simplifying process flows and improving operational efficiency.

The solution provides strong removal of ceria and organic residues to support more consistent electrical performance across critical layers, lowers defectivity in one of the most challenging areas of ceria-based CMP at advanced nodes, and minimizes oxide loss to protect the increasingly delicate film layers used in next generation device architectures.

PCMPSolv™ PCMP2310 also delivers sustainability and manufacturing benefits. By eliminating hazardous SPM-based processes, it reduces chemical waste and lowers CO₂ emissions. Its integrated in situ cleaning approach decreases tool environmental footprint, streamlines fab operations, and improves cost of ownership—without compromising quality or reliability.

Qnity will showcase PCMPSolv™ PCMP2310 alongside its total semiconductor materials offerings in the Qnity Lounge, Feb. 11-13, during SEMICON Korea. The Qnity Lounge is located in the Rose Room on the fifth floor of the Grand InterContinental Seoul Parnas and open to all SEMICON Korea attendees.

The PCMPSolv™ cleans product platform offers solutions for a range of PCMP cleaning processes. Interested parties should contact their account managers or submit an inquiry online to learn more.

 
 
 

About Qnity 
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

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Media Contact

Ashley Boucher

ashley.boucher@qnityelectronics.com

 
 
 
 
 
 

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