Activegrid® inks and films possess excellent optoelectronic properties and flexibility for use in capacitive touch interfaces, IME, smart windows, and displays.

Slurries for chemical mechanical planarization (CMP) in semiconductor fabrication, including options for copper barrier and through silicon via (TSV) with a tunable range of film selectivity.

Circuposit™ desmear process and electroless copper are designed to achieve fine line and high-reliability performance on IC substrates, flexible and rigid PCBs. 

Cyclotene™ advanced dielectric resins couple ultra-low-loss dielectric properties with leading thermal and moisture stability in RF applications.

Duroptix™ products for LED optical encapsulation materials and other silicone-based materials all with high performance and durability.

Photoresists for 193 nm and 193 immersion lithography for precision patterning for high-end memory and logic devices.

Leading family of pads for chemical mechanical planarization (CMP) in advanced node fabrication, with offerings for a range of specific CMP applications.

Interra™ thin copper clad laminates are specifically designed for use as embedded capacitance materials in multilayer rigid printed circuit boards. They offer the best mechanical strength, reliability and capacitance stability on the market.

Kalrez® perfluoroelastomer parts for sealing in harsh environments for mission-critical applications.

Kapton® polyimide films withstand extreme temperature and vibration with a unique combination of electrical, thermal, chemical, and mechanical properties.

Powered by a broad product portfolio and state-of-the-art expertise, we help our partners meet the critical industry demands of the electrical and electronics market.

Microfill™ acid plating copper delivers superior capability on via-filling and uniformity as well as bath stability to facilitate new technology revolution.