Kapton® polyimide films

 
 
 
 
 
 

Reliable insulation for extreme 
environments 

Supplied and engineered by Qnity, Kapton® polyimide film has defined the performance benchmark for high-reliability polyimide insulation for more than 60 years. When aerospace equipment, electric vehicles, and advanced electronics demand exceptional dielectric integrity, thermal stability, and long-term performance, engineers specify Kapton® polyimide film with confidence. 

 
 
 
 
 
 

 

Why engineers choose Kapton® polyimide film

Kapton® polyimide film delivers stable mechanical and electrical performance in conditions that exceed the limits of conventional polymer films. From multilayer insulation (MLI) blankets for satellites and spacecraft to dielectric substrates for flexible and rigid flex printed circuits to electrical insulation and thermal barriers in industrial systems, Kapton® polyimide film is widely specified in mission-critical systems where performance margins are tight, and material failure carries high consequences.

With an operating temperature range of –269 °C to 400 °C and dielectric strength of more than 7,000 V/mil (depending on grade), Kapton® polyimide film is built to perform in high-stakes applications. Available as thin as 4 µm and with thermal conductivity up to ~0.7 W/m·K, engineers have flexibility when incorporating Kapton® polyimide film into their designs. 


A platform of polyimide film solutions

Qnity supplies a broad portfolio of Kapton® polyimide film configurations engineered at the film level to deliver application-specific electrical, thermal, mechanical, and optical performance. This approach allows engineers to fine-tune system behavior without redesigning assemblies and move efficiently from concept through production. The Kapton® polyimide film portfolio includes:

  • General purpose and electrical grade polyimide films.
  • Flexible printed circuit (FPC) polyimide grades with enhanced dimensional stability and adhesion.
  • Heat sealable polyimide constructions for laminated assemblies.
  • Corona-resistant polyimide films for partial discharge and high-voltage environments.
  • Thermally conductive polyimide films for heat-dense electronics.
  • Electrically conductive and ESD-controlled polyimide films.
  • Optical polyimide variants including black, white, and high-transparency films.

 

Engineered confidence for high-reliability systems

With exceptional thermal endurance, dielectric performance, mechanical stability, resistance to chemicals, radiation, and moisture – and a wide breadth of engineered configurations – Kapton® polyimide film is a foundational material for applications where failure is not an option.

 

 
 
 

Polyimide Film Products

 
 
 
  • Kapton® Polyimide films

    Maintains its unique combination of mechanical properties under the harshest of conditions.

    Kapton® B polyimide film is a black, homogeneous opaque material developed for applications requiring consistent performance across a wide temperature range. Its construction and appearance are intended to support industrial uses where dimensional stability and controlled visual characteristics are important.

    Kapton® CRC polyimide film is a homogeneous electrical insulation material engineered for use in high‑voltage environments where corona exposure may occur. It maintains the inherent performance characteristics of Kapton® polyimide films while providing enhanced durability in demanding insulation systems. The film is intended for use as a base insulation material in electrical applications requiring long‑term reliability under electrical stress.

    Kapton® EN polyimide film is a premium dielectric material developed for advanced flexible circuit and interconnect manufacturing. It extends the Kapton® polyimide platform with enhanced processing capability for fine‑feature circuit fabrication. The film is intended to support applications requiring precise dimensional control and reliable performance during circuit manufacturing and end use.

    Kapton® 150EN‑A polyimide film is a premium‑performance polyimide film engineered for use as dielectric substrates in chip‑on‑film (COF), flexible printed circuits, and high‑density interconnects. These films are specifically designed for applications where surface quality, dimensional stability, and coefficient of thermal expansion control are critical, making them well suited for very fine‑pitch circuitry and next‑generation integrated circuit (IC) packaging.

    Kapton® 150EN‑C polyimide film is a premium‑performance polyimide film engineered for use as dielectric substrates in chip‑on‑film (COF), flexible printed circuits, and high‑density interconnects. These films are specifically designed for applications where surface quality, dimensional stability, and coefficient of thermal expansion control are critical, making them well suited for very fine‑pitch circuitry and next‑generation integrated circuit (IC) packaging.

    Kapton® 140EN‑Z polyimide film is a premium‑performance polyimide film engineered for use as dielectric substrates in chip‑on‑film (COF), flexible printed circuits, and high‑density interconnects. These films are specifically designed for applications where surface quality, dimensional stability, and coefficient of thermal expansion control are critical, making them well suited for very fine‑pitch circuitry and next‑generation integrated circuit (IC) packaging.

    Kapton® FCRC polyimide film is a composite insulation material engineered for electrical systems operating in partial discharge environments. Its layered construction integrates corona‑resistant polyimide with a fusible fluoropolymer to support durable insulation designs under electrical stress. The film is intended for use in high‑reliability electrical insulation systems where long‑term performance and processing flexibility are important.

    Kapton® 120FMT616 polyimide film is a composite insulation material engineered to support thermal management needs in demanding electrical and electronic applications. Its layered construction integrates a thermally enhanced polyimide base with fusible fluoropolymer surfaces to enable durable, process-friendly designs.

    Kapton® FN polyimide film is a fluoropolymer‑modified insulation material based on the Kapton® HN polyimide film platform. Its construction is intended to extend Kapton® HN performance into applications requiring additional bonding capability and environmental resistance.

    Kapton® FPC polyimide film is a double‑side surface‑treated film developed specifically for flexible printed circuit manufacturing. It is designed to support reliable circuit fabrication where dimensional control and adhesion consistency are critical during processing and end use.

    Kapton® FWN polyimide films are composite insulation materials engineered for use in magnet wire constructions where robust processing capability and consistent insulation design are required. The product family offers multiple constructions to support different manufacturing and performance needs in electric motor applications.

    Kapton® FWR polyimide film is a heat‑fusible polyimide and FEP fluoropolymer composite film designed to provide durable electrical insulation in demanding environments. It offers a balanced combination of electrical performance, thermal durability, and chemical resistance, with improved hydrolysis resistance compared to commonly used polyimide materials.

    Kapton® HA polyimide film is a general‑purpose, all‑polyimide film offering a reliable balance of mechanical, electrical, and chemical resistance across an extremely wide temperature range. It is well suited for high‑volume applications requiring flexibility, durability, and consistent performance from cryogenic to high temperatures.

    Kapton® HN polyimide film is a general-purpose film that has been used in applications at temperatures as low as -269°C (-452°F) and as high as 400°C (752°F). Kapton® HN can be laminated, metallized, punched, formed, or adhesive coated, making it a recommended choice for applications requiring a well‑balanced set of properties across a wide temperature range.

    Kapton® HPP‑ST polyimide film is a double‑side surface‑treated material developed to support applications requiring consistent processing and performance across a wide temperature range. Its surface treatment is intended to enable reliable integration with typical adhesion systems, as detailed in the applicable technical data sheet.

    Kapton® JP polyimide film is designed for thermoforming applications that require enhanced formability while retaining the inherent performance characteristics of Kapton® polyimide films. Kapton® JP is engineered to support complex forming processes by enabling improved material response during forming and stable part geometry after forming.

    Kapton® MT polyimide film is a thermally conductive insulation material engineered to support heat management and mechanical durability in demanding electrical and electronic applications. It is intended for use in electronic assemblies, including printed circuit boards, and other applications where thermal dissipation and insulation performance are important.

    Kapton® MT+ polyimide film is a homogeneous, thermally conductive film offering increased thermal conductivity compared to Kapton® MT polyimide film and Kapton® HN polyimide film, as demonstrated in technical data. It provides a balanced combination of electrical properties, thermal conductivity, and mechanical toughness for electronic and automotive applications.

    Kapton® PRN polyimide film is suitable for insulating copper conductors in high‑temperature magnet wire applications where improved interlayer adhesion and abrasion resistance are desired. It consists of a 25‑micron Kapton® HN polyimide film core with two high‑melt‑temperature fluoropolymer layers of approximately ten and three microns.

    Kapton® PRT polyimide film is a multi‑layer, heat‑sealable composite film manufactured using high‑tensile‑strength Kapton® polyimide film and an engineered fluoropolymer. It is designed to support electrical insulation constructions where durable bonding, thermal stability, and environmental resistance are important.

    Kapton® PST polyimide film is a tough, crystalline film developed for the pressure sensitive tape industry. It provides a balanced combination of physical, chemical, and electrical properties over a wide range of temperatures and is engineered to support efficient coating and converting operations for advanced tape constructions.

    Kapton® RS polyimide film is an electrically conductive, all‑polyimide material developed for thin, lightweight heating applications. Its inherent resistive construction supports uniform surface heating while remaining flexible and durable at elevated temperatures, with resistance to cracking or abrasion. The film can be tailored for specific current, voltage, and temperature requirements and converted into a variety of heater configurations for industrial, automotive, and aerospace uses.

    Kapton® XP polyimide film is a type Kapton® H polyimide film coated on one or both sides with a proprietary fluorocarbon resin to support reliable adhesion at elevated temperatures. It maintains excellent electrical, chemical, and mechanical performance across wide temperature ranges and demonstrates strong bond strength retention relative to standard fluoropolymer‑coated polyimide films.

  • Oasis® Composite Films

    Engineered with heat sealable fluoropolymer coatings on polyimide materials, this family of composite films excel in the aerospace and cable industries, adhering to rigorous quality and safety standards with ease.

    Oasis® 120TWT561 composite film is a heat‑sealable polyimide/fluoropolymer composite film engineered to meet the lightweight wire requirements of AS22759/80–92 aerospace standards. It combines excellent electrical, thermal, and chemical resistance with controlled bonding behavior to support next‑generation aerospace wire insulation designs.

    Oasis® 200TRT515 composite film is a heat‑sealable polyimide/fluoropolymer composite film engineered to meet the normal‑weight wire requirements of AS22759/80–92 aerospace standards. It delivers a balanced combination of electrical performance, thermal durability, and chemical resistance to support next‑generation aerospace wire insulation designs.

    Oasis® 85FCT161 is a heat‑sealable polyimide/fluoropolymer composite film engineered for lightweight aerospace wire insulation applications. It delivers a balanced combination of electrical performance, thermal durability, chemical resistance, and controlled bonding behavior to support modern composite wire constructions.

 
 
 
 
 
 

Leverage decades of materials innovation  and application development  experience

With exceptional thermal endurance, dielectric performance, mechanical stability, and resistance to chemicals, radiation, and moisture, Kapton® polyimide film provides engineered confidence for high‑reliability systems and demanding applications.   

 

Use our interactive tool to explore the full Kapton® polyimide film portfolio, narrow options by product specs, access data sheets, and identify the right solution for your design.

Films Product Finder
 
 
 

 
 
 

We’re here to help.

We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.