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    Year:   2025   2024   2023   2022 

     
     
     
     
     
     
    Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging
    Qnity has introduced the Stackplane™ CMP slurry platform for advanced packaging, supporting hybrid bonding, TSV integration, polymer CMP, and emerging technologies. Designed for AI, high-performance computing, and next-generation semiconductor manufacturing, Stackplane™ expands Qnity's end-to-end advanced packaging portfolio.
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    Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions
    Qnity introduces an integrated advanced packaging platform combining metallization, bumping, dielectric and patterning technologies to enable AI, HBM, chiplet and 3D semiconductor architectures.
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    Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer
    Qnity has appointed semiconductor finance veteran Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, 2026, reinforcing its commitment to growth, innovation and financial excellence.
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    Qnity to Present at the Goldman Sachs Communacopia and Technology Conference
    Qnity to Present at the Goldman Sachs Communacopia and Technology Conference
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    Qnity Accelerates Advanced Node Materials Innovation with Next-Generation KLA Inspection Capabilities
    Qnity strengthens advanced semiconductor materials development and manufacturing with KLA's Surfscan SP7 XP inspection system, enhancing process control, defect detection, and advanced node innovation.
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    Qnity Reports Second Quarter 2026 Results, Raises Full-Year Financial Guidance
    Qnity Reports Second Quarter 2026 Results, Raises Full-Year Financial Guidance
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    Qnity Powers the Industry’s Shift to Shrink and Stack at SEMICON Taiwan 2026
    Qnity Electronics will showcase its end-to-end semiconductor materials platform at SEMICON Taiwan 2026, featuring CEO Jon Kemp's keynote, advanced packaging innovations, thermal management technologies, and solutions enabling AI, HPC, and next-generation semiconductor manufacturing.
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    Qnity to Present at Deutsche Bank’s 2026 Technology Conference
    Qnity to Present at Deutsche Bank’s 2026 Technology Conference
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    Qnity and University of Delaware College of Engineering Partner to Advance Workforce Development and Manufacturing Innovation
    Qnity and the University of Delaware College of Engineering have formed a strategic partnership to strengthen the semiconductor talent pipeline, expand engineering research collaboration, and accelerate innovation in advanced manufacturing and automation.
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    Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap
    Qnity Electronics expands its advanced packaging innovation roadmap through collaboration with imec, advancing next-generation semiconductor materials for AI, high-performance computing, 3D stacking, chiplets, and heterogeneous integration.
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    Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design
    Qnity introduces Laird™ Tflex™ CR910 liquid gap filler and Laird™ Tgrease™ 3000 thermal grease to help engineers solve thermal management challenges in AI, automotive, semiconductor, SiC and GaN power electronics applications.
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    DuPont to Showcase Kalrez® Advanced Sealing Solutions at Valve World 2025
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    Qnity Receives Zhen Ding 2026 Distinguished Contribution Award
    Qnity has received the Zhen Ding 2026 Distinguished Contribution Award, recognizing excellence in materials, equipment, and services. Through advanced packaging, interconnect, thermal management, and PCB manufacturing solutions, Qnity helps accelerate innovation in AI, high-performance computing, and next-generation electronics.
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