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    Year:   2025   2024   2023   2022 

     
     
     
     
     
     
    Qnity Introduces New Kalrez® High-Temperature Sealing Solution for Semiconductor Manufacturing
    Qnity launches Kalrez® 7080 perfluoroelastomer (FFKM) sealing solutions for semiconductor processes up to 330°C, delivering ultra-low contamination, enhanced equipment reliability, and improved wafer yield.
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    Qnity Showcases Materials Innovation Powering the Next Leap in Electronics at TPCA Show 2026
    Qnity will showcase advanced materials and integrated solutions for AI, high-performance computing and advanced connectivity at TPCA Show 2026. Explore innovations in advanced packaging, interconnects, PCB metallization and thermal management that improve performance, reliability and energy efficiency.
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    Qnity Schedules Third Quarter 2026 Earnings Release and Conference Call
    Qnity Schedules Third Quarter 2026 Earnings Release and Conference Call
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    Qnity Joins PHLX Semiconductor Sector Index (SOX)
    Qnity Joins PHLX Semiconductor Sector Index (SOX)
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    Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging
    Qnity has introduced the Stackplane™ CMP slurry platform for advanced packaging, supporting hybrid bonding, TSV integration, polymer CMP, and emerging technologies. Designed for AI, high-performance computing, and next-generation semiconductor manufacturing, Stackplane™ expands Qnity's end-to-end advanced packaging portfolio.
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    Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions
    Qnity introduces an integrated advanced packaging platform combining metallization, bumping, dielectric and patterning technologies to enable AI, HBM, chiplet and 3D semiconductor architectures.
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    Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer
    Qnity has appointed semiconductor finance veteran Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, 2026, reinforcing its commitment to growth, innovation and financial excellence.
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    Qnity to Present at the Goldman Sachs Communacopia and Technology Conference
    Qnity to Present at the Goldman Sachs Communacopia and Technology Conference
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    Qnity Accelerates Advanced Node Materials Innovation with Next-Generation KLA Inspection Capabilities
    Qnity strengthens advanced semiconductor materials development and manufacturing with KLA's Surfscan SP7 XP inspection system, enhancing process control, defect detection, and advanced node innovation.
    Read More
    Qnity Reports Second Quarter 2026 Results, Raises Full-Year Financial Guidance
    Qnity Reports Second Quarter 2026 Results, Raises Full-Year Financial Guidance
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    Qnity Powers the Industry’s Shift to Shrink and Stack at SEMICON Taiwan 2026
    Qnity Electronics will showcase its end-to-end semiconductor materials platform at SEMICON Taiwan 2026, featuring CEO Jon Kemp's keynote, advanced packaging innovations, thermal management technologies, and solutions enabling AI, HPC, and next-generation semiconductor manufacturing.
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    Qnity to Present at Deutsche Bank’s 2026 Technology Conference
    Qnity to Present at Deutsche Bank’s 2026 Technology Conference
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    Qnity and University of Delaware College of Engineering Partner to Advance Workforce Development and Manufacturing Innovation
    Qnity and the University of Delaware College of Engineering have formed a strategic partnership to strengthen the semiconductor talent pipeline, expand engineering research collaboration, and accelerate innovation in advanced manufacturing and automation.
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