CMP Slurries

 
 
 

CMP Slurries

High-quality CMP slurries backed by the strength of Qnity

Since the earliest days of the chemical mechanical planarization (CMP) process, we’ve been providing CMP slurries to the semiconductor industry. With high-volume production of CMP slurries and other consumables, Qnity is strategically positioned to provide solutions for increasingly complex CMP process requirements.

Qnity’s slurry offerings include a broad range of dielectric and metal polishing solutions.  Our ongoing investment in slurry technology includes a well-funded research and development program, an established and growing product portfolio, and a global footprint of application centers to engage directly to meet customers’ needs.

 

Qnity CMP Slurry Product Families

Stackplane™ :​

Stackplane™ CMP Slurries

Stackplane™ CMP Slurries for Advanced Packaging is a comprehensive slurry platform engineered to support the evolving CMP requirements of advanced packaging applications. Designed for hybrid bonding, TSVs, polymer CMP, and emerging packaging technologies, the platform delivers precise planarization, optimized selectivity, and manufacturing reliability across both wafer-level and die-level processes. The product portfolio includes the SP1000/2000 series for hybrid bonding, SP3000 for TSVs, SP4000 for polymer CMP, and SP5000 for next-generation packaging materials and architectures. Stackplane™ slurries are complemented by Qnity's CMP pads and post-CMP cleans as part of a complete advanced packaging solution.

 
Novaplane™:​

Novaplane™ Slurries

High-performance tungsten CMP solutions for advanced device manufacturing​

The Novaplane™ slurry platform is a family of tungsten (W) CMP slurries engineered to deliver high removal rates, controlled selectivity, and exceptional process stability. Designed for demanding tungsten polishing applications, Novaplane™ slurries help manufacturers achieve tight topography specifications while optimizing throughput and reducing overall process costs.​

Features & Benefits​

• Optimized for tungsten CMP applications requiring fast, consistent material removal​
• Tunable selectivity enables precise balance between tungsten and surrounding materials​
• Supports superior wafer planarity and uniformity across advanced device architectures​
• Engineered to reduce defectivity while maintaining process stability at production scale​
• Helps lower cost of ownership through improved polishing efficiency and consumable performance​
 

Optiplane™:​

Optiplane™ Slurries

Advanced dielectric polishing for next-generation semiconductor devices​

The Optiplane™ slurry platform includes dielectric, nitride, and polysilicon slurries specifically developed for advanced front-end and interlayer dielectric applications. These solutions provide the flexibility required to meet increasingly stringent device specifications while supporting yield improvement and process integration across leading-edge technology nodes.​

Features & Benefits​

• Designed for oxide, nitride, and polysilicon CMP applications​
• Independent tuning of removal rates supports complex integration schemes​
• Enables tighter process control for advanced logic and memory devices​
• Minimizes surface defects and dishing while maintaining excellent uniformity​
• Provides scalable performance from development through high-volume manufacturing​
 

Acuplane™:​

Acuplane™ Advanced Barrier and TSV Slurries

Precision polishing solutions for metallization and advanced packaging​

The Acuplane™ slurry platform is designed for barrier metal removal, through-silicon via (TSV) processing, and advanced packaging applications. With configurable selectivity options and predictable polishing performance, Acuplane™ solutions help manufacturers address the challenges associated with increasingly complex 3D integration and heterogeneous packaging architectures.​

Features & Benefits​

• Specialized for copper barrier, cobalt barrier, TSV, and advanced packaging processes​
• Flexible selectivity options support a wide range of customer integration requirements​
• Enables precise control of metal thickness, topography, and surface quality​
• Supports advanced packaging technologies including CoWoS, silicon interposers, and 3D integration​
• Proven performance across both mature production nodes and advanced semiconductor technologies​
 

Klebosol:​

Klebosol® Slurries

Industry-trusted colloidal silica technology for dielectric polishing​

As the exclusive provider of Klebosol® slurries, Qnity delivers one of the semiconductor industry's most established colloidal silica platforms. Known for exceptional particle stability and consistent polishing behavior, Klebosol® products support a wide range of dielectric CMP processes from mature-node manufacturing to advanced-node applications requiring ultra-high purity materials.​

Features & Benefits​

• Based on highly stable colloidal silica technology with a long history of semiconductor use​
• Supports interlayer dielectric (ILD), shallow trench isolation (STI), polysilicon, and post-metal buff applications​
• Excellent particle uniformity promotes predictable polishing performance and process repeatability​
• Available in formulations for both mature-node and advanced-node manufacturing​
• Ultra-high purity options help meet contamination control requirements for leading-edge devices​
 

Other Slurry Materials

Nanopure™, ILD™ and Other Slurry Materials​

Specialized CMP solutions for silicon and dielectric polishing​

In addition to its primary slurry platforms, Qnity offers a portfolio of specialized slurry technologies designed to address unique process requirements across semiconductor manufacturing. These materials complement existing CMP processes and provide additional flexibility for wafer polishing and dielectric applications.​

Features & Benefits​

• Nanopure™ slurries designed for silicon wafer polishing and polysilicon CMP​
• ILD™ 3000–5000 series supports interlayer dielectric applications requiring robust planarization performance​
• Specialized formulations address application-specific process challenges​
• Broad portfolio enables optimization across multiple CMP process steps​
• Supported by Qnity's technical expertise and global applications infrastructure​

 

​Qnity CMP Slurry Applications

  • Front-end-of-line (FEOL) – Optiplane™ slurries are designed to help customers achieve complex FinFET and advanced front-end memory device integrations. Qnity achieves this by delivering broad, independent control of removal rate for oxides, nitrides and polysilicon materials.
  • Interlayer dielectrics (ILD) – Optiplane™ and Klebosol® slurries are designed to prioritize rate and planarization while minimizing surface defect density and process cost. Qnity’s portfolio includes long-established mature node products using Klebosol® abrasives as well as ultra-high purity abrasives for advanced node ILD needs.
  • Barrier metals – Acuplane™ slurries are designed to precisely remove barrier metals used on copper and cobalt metallization schemes. Qnity slurries are designed as platforms on which customers can request a range of selectivity options. These options enable customers to control final metal interconnect/line thickness, correct topography and control metal and dielectric surface quality.
  • Through silicon via (TSV) – Qnity has an industry-leading portfolio of Acuplane™ TSV slurry solutions for both front and backside polishing. These slurries accommodate silicon, oxide and metal removal needs as defined by customers’ specific device integration needs.
  • Advanced packaging materials – Building on Qnity’s TSV, silicon and polymer polishing expertise, our advanced packaging slurry portfolio extends to enable 3D IC stacking architectures such as chip-on-wafer-on-substrate (CoWoS), silicon interposer integration schemes, and polymer polishing capability.

® Klebosol is a registered trademark of Merck KGaA, Darmstadt, Germany or its affiliates.

 
 
 

  • The chemical mechanical planarization (CMP) process is used to planarize both die level and wafer level topography and also to remove overfill metal and metalloid materials that serve as interconnects in an integrated circuit. CMP pads and slurries are used together in combination on a polishing tool multiple times throughout the semiconductor fabrication process.

    Slurries are made up of a combination of key additives which enable precise polishing of the wafer surface. Slurries are designed to enable the planarization and material removal such that surface quality and material property integrity is maintained or improved. State-of-the-art polishing slurries enable topography or flatness to be maintained at or less than 300 angstroms across a 300mm wafer. Surface finish of materials, including corrosion sensitive metals, is maintained at the single-digit angstrom level.

  • Qnity also offers Nanopure™ slurries for silicon wafer polishing and the ILD™ 3000 -5000 series for interlayer dielectrics.

 
 
 

Materials for CMP

 
 
 

  • CMP Slurries

    A range of offerings for chemical mechanical planarization (CMP) including Novaplane™, Optiplane™, Acuplane™ and Klebosol® slurries.

  • CMP Pads

    Broad portfolio of CMP pads to meet the needs of any application.

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    The Emblem™ CMP pad family is a breakthrough solution with step-out performance and advanced customization for advanced nodes.

    An advanced CMP pad platform designed for multiple applications and advanced nodes. The Ikonic™ pad platform is designed to reduce wafer defects and improve removal rate, topography and cost of ownership.

    The Optivision™ pad series for chemical mechanical planarization (CMP) is Qnity’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

    The Politex™ pad series for chemical mechanical planarization (CMP) is used for copper barrier, buffing and cleaning applications. Politex™ pads are the industry-standard soft pad.

    Qnity's Suba™ pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. The Suba™ family of polishing pad products is the industry standard for silicon stock removal polishing. They may also be used as a sub-pad.
 
 
 

® Klebosol is a registered trademark of Merck KGaA, Darmstadt, Germany or its affiliates.

 
 
 

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