Qnity offers a broad, production-proven range of photoresists with material options that meet requirements across generations of lithography processes from 436nm down to 13.5nm wavelengths, and enable printing of feature size from 10µm down to 10nm.
The drive toward advanced semiconductor device nodes means photoresists must deliver higher resolution with manufacturable process windows and fewer defects. From our g-line, i-line, KrF and ArF photoresists, to our most advanced product families for extreme ultraviolet (EUV) lithography, Qnity has photoresists to match your needs. Combined with Qnity’s complementary overcoats and ancillary products, you get a total materials solution to support your semiconductor manufacturing processes.
Our broad product suite also allows us to tailor photoresists to meet your specific requirements.
Microposit™ and Megaposit™ photoresists (i-line, 365nm; g-line, 436nm)
Microposit™ and Megaposit™ photoresists deliver reliable, high-precision patterning solutions for a wide range of semiconductor and electronic device manufacturing processes.
UV™ photoresists (KrF, 248nm)
UV™ KrF photoresists, designed for 248nm excimer laser lithography, deliver superior resolution and process reliability for advanced semiconductor manufacturing.
Epic™ photoresists (ArF, 193nm)
Epic™ IM photoresists are designed for the unique environment created by immersion lithography, in which water between the lens and the wafer enables exposure of finer patterns.
Eon™ photoresists (EUV, 13.5nm)
Eon™ EUV photoresist product line delivers high‑resolution patterning for advanced logic and next‑generation DRAM devices, providing exceptional linewidth roughness, CD uniformity, and robust etch resistance for reliable pattern transfer. Optimized for both contact‑hole and line‑and‑space applications, it offers a broad process window and strong stochastic defect control to minimize post‑etch and blob‑type defects, enabling stable manufacturing and improved overall yield.
Qnity’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
Used in conjunction with photoresists, Qnity’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
Functional sublayer materials enabling advanced DUV, ArF, and EUV patterning for logic and memory devices
Qnity’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
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