Lithography has been driving semiconductor device scaling since the 1970’s, enabling semiconductor chips to be faster, denser, and more cost effective and energy efficient. Qnity designs and customizes lithographic materials to enable advanced patterning as well as improve existing lithography processes. Our long history in lithography technology includes many industry-first enabling technology innovations such as embedded barrier layer technology for 193 immersion lithography and anti-reflective coating materials. We offer a full range of commercial products, including extreme ultraviolet (EUV) photoresists, ArF dry and immersion photoresists, KrF photoresists, i-line and g-line photoresists, EUV underlayer materials, and organic bottom anti-reflective coating (BARC) materials.
By understanding your technical challenges, we design and customize lithographic material solutions to address them. As lithographic processes become more advanced, the need for tailored material design becomes increasingly critical.
Qnity’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
Used in conjunction with photoresists, Qnity’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
Functional sublayer materials enabling advanced DUV, ArF, and EUV patterning for logic and memory devices
Qnity’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.