Pyralux® FR Copper-Clad Laminate features Kapton® polyimide film bonded to copper foil, on one or both sides, with with a proprietary flame retardant C-staged modified acrylic adhesive. These copper-clad laminates are recommended for use in single-sided, double-sided, multilayer, and rigid-flex circuits that require flame retardancy. All copper-clad laminates are available with rolled-annealed (RA) or electro-deposited (ED) copper foil. Double-treated copper foil (nodules of electrodeposited copper on both sides of the copper foil) is also available to eliminate surface preparation steps prior to resist or coverlay lamination.
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| Property | Method | Unit | Value |
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| Peel Strength (Adhesion to Copper) As Received, After Solder | IPC-TM-650 2.4.9 | N/mm (lb/in) N/mm (lb/in) | 2.1 (12.0) 1.9 (11.0) |
| Dielectric Constant (Dk) | IPC-TM-650 2.5.5.3 ASTM D2520 | 1 MHz 10 GHz | 3.6 3.0 |
| Dimensional Stability (MD/TD) | IPC-TM-650 2.2.4 | % | ± 0.10 % |
| Surface Resistance | IPC-TM-650 2.5.17 | Ω | > 1015 |
| Volume Resistivity (prlx-32) | IPC-TM-650 2.5.17 | Ω ·cm | > 1015 |
| Loss Tangent (Df) | IPC-TM-650 2.5.5.3 ASTM D2520 | 1 MHz 10 GHz | 0.03 0.02 |
| Solder Float, 288 °C for 10 s | IPC-TM-650 2.4.13 | — | Pass |
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Fabric/material |
FR CL/BP |
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Design |
FR7332 |
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Seam |
FR CL/BP |
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Packaging |
FR7332 |
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Hazard |
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Coated Material |
FR CL/BP |
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Features |
ADHESIVE |