Riston® LDI7030

Riston® LDI7030

Qnity began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films. Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.

Applications
  • Negative working, aqueous processable polymer film
  • Print-and-Etch and Tent-and-Etch applications
  • Suitable for UV-LASER 355 nm Direct Imaging
Special Warnings
  • Clean at least once a week to remove resist residue, calcium carbonate (scale), defoamer, and dye from developed resist. Dye build-up can be minimized by the use of anti-foam.
  • Do not add defoamer to the supply tank or to the replenishment solution.
  • Hanging panels vertically or stacking on edge after cool down. If innerlayers are stacked horizontally in trays, the stack height should be limited especially for panels with thin photoresist and fine circuitry
  • Stack on edge vertically after cooling; avoid dust and dirt trapping between panels; insert unlaminated panel between stack support and first laminated panel to protect laminated panel.
  • Unlaminated support panel should be at least as big as the laminated panels. Thin flexible innerlayers usually cannot be racked.
Recommendations
  • 3F or 4F grade, fused, 15-20 % v/v, 9-12 mm (3/8-1/2") brush foot print, fines removal and replenishment per vendor recommendations; high pressure (10 bar) final rinse (pH 6-8); hot air dry.
  • 3F or 4F grade, unfused, 15-20 % v/v, fines removal and replenishment per vendor recommendations; high pressure 10 bar (147 PSI) final rinse (pH 6-8); hot air dry.
  • 500 grit; 7-9 mm (1/4- 3/8") brush foot print; high pressure (8- 10 bar) final rinse (pH 6-8)
  • 500 grit; 7-9 mm (1/4-3/8") brush foot print; final rinse: 2-3 bar, pH 6-8
  • Drying: blow dry thoroughly; Hot air preferred.
  • Effective Rinse Length: 1/3-1/2 of length of developer chamber; >1/2 preferred.
  • Rinse spray pressure: 1.4-2.4 bar (20-35 psig). Use high impact , direct-fan nozzles.
  • Rinse temperature: 15-25°C (60-80°F)
  • Rinse water: hard water (150-250 ppm CaCO3 equivalent). Softer water can be hardened by the addition of calcium chloride or magnesium sulfate.
Solutions
  • Batch: up to 0.5 mil-m2 /liter (20 mil-square feet/gallon). Maintain breakpoint at <50% by lowering conveyor speed or by starting batch stripping with a lower breakpoint and changing the solution once breakpoint moves above 50%.
  • Developer conveyor speed: see “Dwell Time”.
  • Dry Film Photoresist
  • Feed & Bleed: to keep loading at about 0.2 milm2/liter (8 mil-ft2/gal), activate addition of fresh developer at pH 10.5; stop addition when pH 10.7 is reached.
  • Filtration Systems Spray stripping equipment should contain a filtration system to collect and remove resist skins to avoid nozzle clogging, to extend stripper life, and to avoid resist skins from reaching the rinse chamber.
  • Preferred: Continuous replenishment (feed & bleed) using board count. Maintain resist loading at < 0.4 mil-m2 /liter (< 15 mil-square feet/ gallon).
  • The most effective filter systems collect the stripper skins immediately after they were generated, before entering recirculation pumps, and they feature continuous removal of skins from the stripper solution.
 
 
 

Features & benefits

  • Customized for tent and etch processes with 355nm direct imaging equipment
  • Excellent tenting strength, resolution and adhesion
  • Fast stripping that contributes to higher yield and productivity
    		•
    Double-Treated Copper Surfaces
  • Normally no prelamination cleaning required; vapor degreasing or chemical cleaning to remove organics is optional. Tacky roller cleaning recommended to remove particles.
    		•
    Proprietary Strippers
  • Are used for higher strip speed, higher resist loading, to minimize chemical attack on tin or tin/lead, or to reduce copper oxidation, e.g. to facilitate AOI.
    		•
    Defoamers
  • Riston® LDI7000 has been successfully used without defoamer. If required, add 0.80 ml/liter (3 ml/gallon) of polyethylene-polypropylene glycol block co-polymer.
    		•
    ETCHING
  • CHING Riston® LDI7000 series resists are compatible with most acid etchants, e.g. cupric chloride (free HCl normality < 3.0 N), H2 O2 /H2 SO4 , and ferric chloride.
    		•
    Electrochemically Cleaned Copper
  • The alkaline electrochemical cleaner first removes trace organics and chromates. After a rinse, a microetch removes about 0.8μm (30 microinches) of copper. Following a second rinse an antitarnish may be applied.
    		•
    Electrochemically Cleaned Vendor Copper
  • Conveyorized systems combining reverse current electrochemical cleaning and microetching are offered to effectively remove chromate conversion coatings with minimal copper removal.
    		•
    Chemically Cleaned Copper
  • A 10% sulfuric acid spray may be used between alkaline cleaner and microetchant to help with the conversion coating removal
  • Alkaline Spray Cleaner for removal of organic contaminants followed by a spray microetchant for conversion coating (chromate) and/or copper oxide removal (about 2-2.5 μm; 80-100 microinch etch).
  • In this case only 1.5 μm (60 microinch) microetch depth is required. To remove residual salts after microetching from the copper surface, an acid rinse or efficient water spray rinsing have been employed successfully.
    		•
    PERFORMANCE ON FLEXIBLE SUBSTRATES
  • LDI7000 can be used successfully on thin core laminate and flexible substrates.
    		•
     
     
     

    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    18422 0 0 0
    18483 0 0 0
    13756 0 0 0
     
     
     

    Physical Properties

    Property Value Unit Method
    Exposure Energy RST SST mJ/cm2 13 –28
    Dwell Times — (riston-1) sec 18-24
    3.0 wt% NaOH — (riston-1) kg 30 – 40 sec
    Print-Out (Phototropic) Image — (riston-1) — Strong
    Seal Bar Temp Automatic Cut Sheet Laminator — 60 ± 10°C (140 ± 18° F)
    Odor — (riston-1) — Low
    Lam. Roll Pressure Automatic Cut Sheet Laminator — 3.0-5.0 bar ( 43-72 psig)
    Pre-Heat HRL Hot Roll Laminators — Optional
    Seal Bar Pressure Automatic Cut Sheet Laminator — 3.5-4.5 bar (50-65 psig)
    Exposed Color in Daylight — (riston-1) — Blue
    Air Assist Pressure HRL Hot Roll Laminators — 0-2.8 bar (0-40 psig)
    Available Thickness — (riston-1) — 30 & 38 μm 1.25 &1.5 mils
    Unexposed Color in Yellow Light — (riston-1) — Green
    Lamination Temp Automatic Cut Sheet Laminator — 115 ± 5°C (240 ± 10°F)
    Roll Speed HRL Hot Roll Laminators — 0.6-1.5 m/min (2-5 ft/min)
    Lamination Speed Automatic Cut Sheet Laminator — 1.5-3 m/min (5-10 ft/min)
    Contrast to Copper — (riston-1) — Strong
    Seal Time Automatic Cut Sheet Laminator — 1-4 seconds
    Roll Temperature HRL Hot Roll Laminators — 115 ± 5°C (240 ± 10°F)
    Exposed Color in Yellow Light — (riston-1) — Green
    K2CO3 — (riston-1) kg wt% x sump vol liters x 0.01
    — (riston-1) — 1.0 wt%
    — (riston-1) lb wt % x sump vol gallons x 0.083
    Na2CO3 — (riston-1) kg wt% x sump vol liters x 0.01
    — (riston-1) — 0.85 wt%. Use 8.5 g/l (0.071 lb./gal)
    — (riston-1) lb wt% x sump vol gallons x 0.083
    Na2CO3•H2O — (riston-1) — 1.0 wt%. Use 10 g/l (0.083 lb./ gal)
     
     
     
    Product Details

    Fabric/material

    TOWANDA FLAMMABLE

    Design

    LDI7030

    Seam

    LD7000

    Packaging

    LDI7030

    Hazard

    Coated Material

    PRIMARY IMAGING FILM

    Features

    CI-LDI
     
     
     
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