RISTON-LDI-7299

RISTON-LDI-7299

Qnity began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films. Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.

Special Warnings
  • Do not add defoamer to the supply tank or to the replenishment solution.
  • Hanging panels vertically or stacking on edge after cool down. If innerlayers are stacked horizontally in trays, the stack height should be limited especially for panels with thin photoresist and fine circuitry
  • High intensity (>75 foot-candles) yellow “safe light” can cause a change in photospeed over time) and should be avoided.
  • Note safety and industrial hygiene precautions. Consult the Material Safety Data Sheet (MSDS) of any chemical used. MSDS’s for WB Series Micrographic Film are available from your Qnity Representative.
  • Protect photoresist through lamination and development steps from UV radiation and visible light up to 450 nm by use of yellow, amber or gold fluorescent “safe lights”
  • Stack on edge vertically after cooling; avoid dust and dirt trapping between panels; insert unlaminated panel between stack support and first laminated panel to protect laminated panel.
  • Unlaminated support panel should be at least as big as the laminated panels. Thin flexible innerlayers usually cannot be racked.
Solutions
  • Batch: up to 0.5 mil-m2 /liter (20 mil-square feet/gallon). Maintain breakpoint at <50% by lowering conveyor speed or by starting batch stripping with a lower breakpoint and changing the solution once breakpoint moves above 50%.
  • Developer conveyor speed: see “Dwell Time”.
  • Dry Film Photoresist
  • Feed & Bleed: to keep loading at about 0.2 mil-m2 /liter (8 mil-ft2 /gal), activate addition of fresh developer at pH 10.5; stop addition when pH 10.7 is reached.
  • Filtration Systems Spray stripping equipment should contain a filtration system to collect and remove resist skins to avoid nozzle clogging, to extend stripper life, and to avoid resist skins from reaching the rinse chamber.
  • Preferred: Continuous replenishment (feed & bleed) using board count. Maintain resist loading at <0.4 mil-m2 /liter (<15 mil-square feet/gallon)
  • The most effective filter systems collect the stripper skins immediately after they were generated, before entering recirculation pumps, and they feature continuous removal of skins from the stripper solution.
 
 
 

Features & benefits

  • Available in thicknesses ranging from 40 microns to 100 microns
  • Broad range of plating solutions (copper, tin, solder, nickel and gold)
  • Designed to provide superior performance on LDI imaged outerlayer boards
  • Gives fabricator one film to meet all of their imaging needs
    		•
    Double-Treated Copper Surfaces
  • Normally no prelamination cleaning required; vapor degreasing or chemical cleaning to remove organics is optional. Tacky roller cleaning recommended to remove particles.
    		•
    Proprietary Strippers
  • Are used for higher strip speed, higher resist loading, to minimize chemical attack on tin or tin/lead, or to reduce copper oxidation, e.g. to facilitate AOI.
    		•
    Defoamers
  • Riston® LDI7200 has been successfully used without defoamer
    		•
    Electrochemically Cleaned Copper
  • The alkaline electrochemical cleaner first removes trace organics and chromates. After a rinse, a microetch removes about 0.8μm (30 microinches) of copper. Following a second rinse an antitarnish may be applied.
    		•
    Electrochemically Cleaned Vendor Copper
  • Conveyorized systems combining reverse current electrochemical cleaning and microetching are offered to effectively remove chromate conversion coatings with minimal copper removal.
    		•
    Chemically Cleaned Copper
  • A 10% sulfuric acid spray may be used between alkaline cleaner and microetchant to help with the conversion coating removal
  • Alkaline Spray Cleaner for removal of organic contaminants followed by a spray microetchant for conversion coating (chromate) and/or copper oxide removal (about 2-2.5 μm; 80-100 microinch etch).
  • In this case only 1.5 μm (60 microinch) microetch depth is required. To remove residual salts after microetching from the copper surface, an acid rinse or efficient water spray rinsing have been employed successfully.
    		•
    PERFORMANCE ON FLEXIBLE SUBSTRATES
  • LDI7200 can be used successfully on thin core laminate and flexible substrates.
    		•
    PLATING
  • Riston® LDI7200 series resists can be used for pattern plating processes with acid copper. Riston® LDI7200 has very good resistance to lifting and underplating.
    		•
     
     
     

    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    16469 0 0 0
    92031 0 0 0
     
     
     

    Physical Properties

    Property Value Unit Method
    Lamination Temp Automatic Cut Sheet Laminator — 115 ± 5°C (240 ± 10°F)
    Seal Time Automatic Cut Sheet Laminator — 1-4 seconds
    Lam. Roll Pressure Automatic Cut Sheet Laminator — 3.0-5.0 bar ( 43-72 psig)
    Exposed Color in Daylight — (riston-1) — Blue
    Available Thickness — (riston-1) — 50μm, 62μm, and 75μm
    Seal Bar Temp Automatic Cut Sheet Laminator — 60 ± 10°C (140 ± 18°F)
    Contrast to Copper — (riston-1) — Strong
    Lamination Speed Automatic Cut Sheet Laminator — 1.5-3 m/min (5-10 ft/min)
    Roll Speed HRL Hot Roll Laminators — 0.6-1.5 m/min (2-5 ft/min)
    Unexposed Color in Yellow Light — (riston-1) — Green
    Odor — (riston-1) — Low
    Print-Out (Phototropic) Image — (riston-1) — Strong
    Exposed Color in Yellow Light — (riston-1) — Green
    Air Assist Pressure HRL Hot Roll Laminators — 0-2.8 bar (0-40 psig)
    Pre-Heat HRL Hot Roll Laminators — Optional
    Roll Temperature HRL Hot Roll Laminators — 115 ± 5°C (240 ± 10°F)
    Seal Bar Pressure Automatic Cut Sheet Laminator — 3.5-4.5 bar (50-65 psig)
    K2CO3 — (riston-1) — wt % x sump vol gallons x 0.083
    — (riston-1) sec 0.8-1.0 wt%; 0.9 wt% preferred
    Na2CO3•H2O — (riston-1) sec 0.8-1.0 wt%; 0.9 wt% preferred
    — (riston-1) — 1.0 wt%. Use 10 g/l (0.083 lb./ gal)
    Breakpoint — (riston-1) — 50-65 %
    Na2CO3 — (riston-1) sec 0.7-1.0 wt%; 0.85 wt% preferred
    — (riston-1) — wt% x sump vol gallons x 0.083
    Spray Nozzles — (riston-1) sec high impact direct-fan nozzles
    Temperature — (riston-1) sec 27-32°C (80-90°F) preferred
    Spray Pressure — (riston-1) sec 1.4 –2.1bar (20-30 psig)
     
     
     
    Product Details

    Fabric/material

    TOWANDA FLAMMABLE

    Design

    LDI7299 TTM

    Seam

    LD7000

    Packaging

    LDI7299 TTM

    Hazard

    Coated Material

    PRIMARY IMAGING FILM

    Features

    CI-LDI
     
     
     
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