Riston® PM240

Riston® PM240

The demands on printed circuit manufacturers are continually increasing as the market demands finer features. Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate. In addition to high yields, PlateMaster was designed to give the fabricator robust process latitude.

Applications
  • Available in 40 micron (1.5 mil), 50 micron (2.0 mil), and 75 micron (3.0 mil) thicknesses.
  • Designed for pattern plate applications on scrubbed and unscrubbed electroless copper, and Direct Plate surfaces
  • Improved dry film conformation under conversional lamination parameters
  • Increased productivity (Photospeed, development speed and stripping speed).
  • Negative working, aqueous processable dry film photoresist
  • Strong mechanical scratch resistance for development and post development process to achieve high yields
  • Vivid print out image after exposure.
Special Warnings
  • Consult the Material Safety Data Sheet (MSDS) for Riston® dry film photoresist vapors. The vapor MSDS for this film was prepared using the highest lamination roll temperature recommended for use.
  • Ensure that panel holes are completely dry before resist lamination.
  • For more Safe Handling information, see publication Technical Bulletin TB-9944 , “Handling Procedure for Qnity Photopolymer Films”.
  • If you choose to exceed this temperature, be aware that the amount of vapor may increase and that the identity of the materials vaporized may vary from those in the MSDS.
  • Note comments under Safe Handling with respect to exceeding highest recommended lamination roll temperature.
  • Panels may be exposed immediately after lamination; however, allow enough time for panels to cool to room temperature before exposure for phototool dimensional stability
  • Reduced lamination roll pressure and/or temperature may be required in tenting applications to avoid tent breakage and resist flow into through-holes.
  • Resist wrinkling can be aggravated by high temperature or panel preheating. Decrease roll temperature or eliminate preheat.
  • Start with Roll temperatures of 110 to 115°C and adjust as necessary.
Solutions
  • Dry Film Photoresist
 
 
 

Features & benefits

Stripping
  • Riston® PlateMaster PM200 film is formulated to dissolve slowly in stripping solution after breaking up into pieces. This can greatly increase the life of stripping solution and reduce costs, if the resist can be removed before dissolving.
    		•
    Lamination
  • Riston® PlateMaster PM200 was formulated for excellent conformation in hot roll lamination.
    		•
    Development
  • Developed in sodium or potassium carbonate with good productivity. It has wide development latitude and is less sensitive to developer concentration, breakpoint, and rinse water hardness than most other resists.
    		•
    Plating
  • Riston® PlateMaster PM200 can be used for pattern plate processes with acid copper, tin/lead, tin, nickel and gold plating baths. Riston® PlateMaster PM200 has very strong resistance to lifting and underplating.
    		•
    Exposure
  • Resolution down to 50 microns (2 mil) lines and spaces is possible with Riston® PlateMaster PM200 in optimized production environments.
  • Riston® PlateMaster PM200 can be exposed on all standard equipment used in the printed circuit board industry. Choose lamps that compliment the peak resist response of 350 to 380 nm.
  • Riston® PlateMaster PM200 has better resolution and wider exposure latitude than other resists. It is also more resistant to off-contact exposure defects, which are common in glass/ glass exposure frames
    		•
    Etching
  • Riston® PlateMaster PM200 is compatible with most acid etchants, e.g., cupric chloride (free HCl normality < 3.0 N), hydrogen peroxide/sulfuric, and ferric chloride.
  • Riston® PlateMaster PM200 is not formulated to resist most alkaline ammonical etch processes.
    		•
    Copper Surfaces and Surface Preparation
  • PlateMaster PM200 has very strong resistance to lifting on all surfaces
    		•
     
     
     

    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    81375 0 0 0
    69750 0 0 0
    93 0 0 0
     
     
     

    Physical Properties

    Property Value Unit Method
    Exposure Energy RST SST mJ/cm2 35-78
    1.5wt% NaOH — (riston-1) — 130-160
    3.0 wt% NaOH — (riston-1) sec 60-80
    Dwell Times — (riston-1) sec 32-48 secs
    3.0wt% KOH — (riston-1) — 110-140
    1.5 wt% KOH — (riston-1) — 140-170
    Pre-Heat Qnity HRL-24 & HRL-24 Film Laminator — 45-50°C on Cu surface (optional)
    Automatic Cut Sheet Laminator — 45-50°C on Cu surface
    Lam. Roll Pressure Automatic Cut Sheet Laminator — 3.0-5.0 bar (43-72 psig)
    Seal Time Automatic Cut Sheet Laminator — 1-4 seconds
    Air Assist Pressure Qnity HRL-24 & HRL-24 Film Laminator — 0-2.8 bar (0-40 psig)
    Lamination Roll Temperature Automatic Cut Sheet Laminator — 100-115°C
    Qnity HRL-24 & HRL-24 Film Laminator — 100-120°C (215-245°F)
    Lamination Speed Automatic Cut Sheet Laminator — 1.5-3 m/min
    Seal Bar Pressure Automatic Cut Sheet Laminator — 3.5-4.5 bar (50-65 psig)
    Seal Bar Temp Automatic Cut Sheet Laminator — 50 - 80°C
    Roll Speed Qnity HRL-24 & HRL-24 Film Laminator — 0.6-1.5 m/min (2-5 ft/min)
    Batch Processing — (riston-1) — 0.19 m2 /liter o.15 m2 /liter (7.7 ft2/gal) (6.1 ft2 /gal)
    Breakpoint — (riston-1) — 50-70 % (60 % preferred)
    — (riston-1) sec 50% or lower
    NaOH (riston-71) — (riston-1) sec 1.5 - 3.0wt%; faster stripping at 3wt%
    Na2CO3 — (riston-1) — 0.7-1.0 wt%; 0.85 wt% preferred
    Rinse Water — (riston-1) — hard water (150-250 ppm CaCO3 equivalent)
    Feed & Bleed — (riston-1) — 0.12 m2 /liter 0.10 m2 /liter (4.9 ft2/gal) (4.1 ft2/gal)
    K2CO3 — (riston-1) — 0.75 -1.0 wt%; 0.9 wt% preferred
    Drying — (riston-1) sec blow dry thoroughly; Hot air preferred
    Spray Pressure — (riston-1) — 1.4-2.4 bar (20-35 psig)
    — (riston-1) sec 1.4-2.4 bar (20-35 psig)
    Rinse Spray Nozzles — (riston-1) sec High Impact, direct fan nozzles preferred
    Temperature — (riston-1) — 27-30°C (80-85°F); 28°C(82°F) preferred
    Spray Nozzles — (riston-1) sec High Impact direct fan
    KOH — (riston-1) sec 1.5 - 3.0wt%; faster stripping at 3wt%
    Na2CO3•H2O — (riston-1) — 0.8-1.1 wt%; 1.0 wt% preferred
     
     
     
    Product Details

    Fabric/material

    GRECO PROD

    Design

    PM240

    Seam

    PM200

    Packaging

    PM240

    Hazard

    Coated Material

    PRIMARY IMAGING FILM

    Features

    CI-CONVENTIONAL
     
     
     
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