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    Year:   2025   2024   2023   2022 

     
     
     
     
     
     
    Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
    Qnity launches its Advanced Packaging Innovation Hub, showcasing materials and process technologies for AI infrastructure, HBM, chiplet architectures, hybrid bonding, TSVs, IC substrates and next-generation semiconductor packaging.
    Read More
    Qnity Brings Semiconductor Expertise to Industrial Valves with Kalrez® Sealing Solutions
    Qnity introduces advanced Kalrez® sealing solutions for industrial valves, enabling superior reliability, reduced fugitive emissions, and longer service life in demanding semiconductor, chemical, energy, and oil & gas applications.
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    Qnity to Present at the Wolfe Research Materials of the Future Conference
    Qnity CEO Jon Kemp will speak at the Wolfe Research Materials of the Future Conference on June 16, 2026. Watch the live webcast and replay online.
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    Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing
    Qnity introduces Optivision™ Max CMP polishing pads, delivering improved defect control, extended pad lifetime, and higher yield for advanced semiconductor nodes and device architectures.
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    Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
    Qnity introduces advanced packaging materials for organic interposer applications, enabling high-density RDL, AI GPU performance, and next-gen semiconductor packaging.
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    Qnity Earns Top Innovation Award for Breakthroughs in Sustainable Semiconductor Manufacturing
    Qnity earns the 2026 ACS Heroes of Chemistry Award for non-fluorine photoresist innovations advancing sustainable semiconductor manufacturing and next-gen lithography.
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    Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials
    Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials
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    Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance
    Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance
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    Qnity Wins 2026 Edison Award for Emblem™ Next-Generation CMP Pad Platform
    Qnity Electronics wins the 2026 Edison Award for its Emblem™ next‑generation CMP pad platform, recognizing breakthrough innovation in advanced‑node semiconductor manufacturing for AI and high‑performance computing.
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    Qnity Announces Second Quarter 2026 Dividend on Common Stock
    Qnity Announces Second Quarter 2026 Dividend on Common Stock
    Read More
    Qnity Schedules First Quarter 2026 Earnings Release and Conference Call
    Qnity Schedules First Quarter 2026 Earnings Release and Conference Call
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    Qnity Advances More Sustainable Semiconductor Manufacturing through Photoresist Innovation
    Qnity expands non‑fluorine photoresists for KrF and ArF immersion lithography, delivering strong process windows, consistent imaging and more sustainable semiconductor manufacturing.
    Read More
    Qnity Joins Apple’s American Manufacturing Program
    Qnity Joins Apple’s American Manufacturing Program
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