Join us at IMPACT Conference Taiwan 2025
October 22 @ TaiNEX 1, Taipei
As a leader in advanced interconnect solutions, we are dedicated to fostering innovation and collaboration with industry pioneers in the artificial intelligence (AI) market.
We invite you to engage with our experts during the session "Enhanced Energy Efficiency in AI: Advanced Packaging and PCB Technologies for Sustainable Innovation" at the IMPACT Conference Taiwan 2025. This session will highlight cutting-edge developments in advanced packaging and circuit material solutions that are shaping the future of AI.
13:00 - 15:00, October 22
504b, 5F, TaiNEX 1
Enhanced Energy Efficiency in AI: Advanced Packaging and PCB Technologies for Sustainable Innovation
13:00 - 13:15
Powering the Next Leap Forward
Chuck Xu
Vice President and General Manager, Interconnect Solutions
Qnity™, DuPont Electronics
13:15 - 13:45
The Evolution of Chip Package Interaction (CPI) Considerations and Technology Impact in Packaging and Assembly
Andrew Yeoh
Director, CPI and Specialty Division
Taiwan Semiconductor Manufacturing Company
13:45 - 14:15
Advanced Packaging Challenges and Opportunities
Shin-Puu Jeng
Vice President, Technology
Applied Materials
14:15 - 14:35
One-Bath Electroplating for All Layers in Chip-Scale-Packaging: Empowering Edge Mobile and AI
Chieh-Ju Li
R&D Chemist
Qnity™, DuPont Electronics
14:35 - 15:00
Advanced Flex Technologies For AI, Cloud, and Edge Computing
Michael Chang
Business Development Consultant, Advanced Flex Technologies
Qnity™, DuPont Electronics
TPCA Show Taipei | October 22-24, 2025
Booth #L421, 4F, Hall 1, Taipei Nangang Exhibition Center
Our experts will be present at the company’s booth to share their extensive knowledge and insights on technological advancements and industry trends.
10:00-17:00, October 22-23
10:00-15:00, October 24
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and solve the challenges of our time.