Qnity’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers.
CuSolve™ products are copper / cobalt compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.
EKC570 PERR
EKC570 SAC™ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
EKC580 PERR
EKC580 is a Copper Post-Etch Residue Remover formulation optimized for Metal Hard Mask (MHM) with TiN Etch tuning and is manufacturing proven.
EKC590 PERR
EKC590 PERR is a Copper Post-Etch Residue Remover formulations optimized for Metal Hard Mask (MHM) with TiN and AlN etch tuning and with Co liner compatibility.
CPEC4100 PERR
CPEC4100 is a High performance, selective cleaner with a broad process window on Cu PER and CuOx residue removal.
CPEC5100C PERR
CPEC5100C is a ELA (Extremely Low Azole) Copper Post-Etch Residue Remover formulation optimized for Metal Hard Mask (MHM) with TiN Etch tuning.
The SAC™ (semi-aqueous chemistry) series of products comprise the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.
SAC™ EKC652
SAC™ EKC652 is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
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