Aurolectroless™ SMT-520 Immersion Gold is the latest final finish product from Qnity. Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless nickel and palladium.
ENIG deposits formed in conjunction with Qnity's Duraposit™ SMT 88 Electroless Nickel bath deliver excellent shelf life and solder joint performance.
Key Benefits:
- Up to 50% lower make-up and running cost
- Flexible gold thickness control
- Uniform and low porosity deposits
- Excellent corrosion resistance
- Excellent bath life and stability (up to 20 MTO)
Tremendous Gold Cost Savings
Free of "Black Pad" Corrosion
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