SHANGHAI, China, Mar. 23, 2026 – Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced today that it will showcase its comprehensive artificial intelligence (AI) –enabling solutions at CPCA Show 2026, Booth 8D10 from March 24 to 26.

“As demand accelerates for AI and data center applications, Qnity is committed to powering advanced packaging and integrated circuit materials that drive higher performance, reliability, and signal integrity,” said Chuck Xu, President, Interconnect Solutions, Qnity. “By continuously innovating and collaborating with our partners, we enable faster data processing and seamless connectivity for AI systems, ensuring sustainable growth and empowering the next generation of technology.”

For AI server applications, Qnity offers a comprehensive metallization portfolio, including Copper Gleam™ PPR pulse acid copper plating, a next‑generation solution that delivers excellent throwing power on through‑hole to support finer line widths. Circuposit™ 6800W electroless copper demonstrates strong reliability performance in advanced micro‑via structures. In addition, Microfill™ EVF‑IV acid copper provides outstanding panel deep via filling performance to support the evolution of high‑density AI server architectures.

Qnity provides a comprehensive portfolio of dry film photoresists for advanced PCB applications, including multilayer boards, HDI, and IC substrates for AI‑driven systems. Riston® DI86 dry film photoresists balance strong tenting with fine line resolution, while Riston® DI16 and DI16M dry film photoresists enable ultra‑fine line patterning for signal integrity and reliability. Riston® DWB81M dry film photoresists support super‑fine lines and thick copper plating for high‑power and thermal management needs.

In advanced packaging for AI computing, Qnity highlights Solderon™ BP TS7000 solder and Intervia™ 8540HSP multi-role copper, designed to support fine‑pitch micro‑bumps for HBM and 2.5D/3D packaging while delivering excellent coplanarity and reliability. Qnity also features Cyclotene™ dry film photo‑imageable dielectric, optimized for glass core substrate build‑up and through‑glass‑via and cavity filling, offering excellent patterning resolution and processing throughput. The material acts as a stress buffer to mitigate glass cracking and demonstrates strong reliability under multi‑reflow and high‑temperature testing.

To support the high speed, high frequency signal performance required for next generation AI architectures, Qnity offers Interra™ HK04J thin copper clad laminates.

Join Qnity at CPCA Show 2026!

We invite you to connect with Qnity and discover innovative technologies driving the electronics advancement in China.

About Qnity 
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Qnity Media Contact

Winnie Chou
winnie.chou@qnityelectronics.com
+886922203452