Laird Technologies Expands Cleveland R&D Center to Advance Materials Innovation for AI and High-Performance Computing

The expanded facility brings together Laird’s technical talents and advanced equipment to accelerate the development of breakthrough solutions in advanced electronics

CLEVELAND, OHIO, Nov. 24, 2025 – Qnity Electronics, Inc. (Qnity), a premier technology solutions leader across the semiconductor value chain, today announced the expansion and enhancement of Laird Technologies’ (Laird) Thermal and Electromagnetic Interference (EMI) Management Solutions Research and Development Center in Cleveland, Ohio. Laird Technologies, part of Qnity, is a global solutions provider of advanced electronic materials for thermal management and signal integrity.

The expanded facility will serve as a strategic base for formulating, testing, and speeding to market a range of functionalized materials that remove unwanted heat and improve signal integrity in advanced technologies – from artificial intelligence chips and smartphone components to automotive electronics and data center equipment.

“As devices become thinner, faster, and more connected, our teams ensure that solutions to challenges like signal integrity, managing power, and controlling heat keep pace with next generation requirements,” said Chuck Xu, Qnity President, Interconnect Solutions. “And as those solutions become increasingly more complex with higher performance and quality standards, demand is rising for the materials that connect and protect. Through advanced research and accelerated development of innovative materials and technologies, our teams at the Laird R&D center in Cleveland are making tomorrow’s technologies possible in partnership with the world’s leading technology companies.”

The expanded facility brings together skilled technical staff and a comprehensive array of new capital equipment to develop breakthrough solutions. These solutions include:

• Thermal interface materials, including gap fillers and phase-change materials.
• EMI mitigation solutions, including absorbers, electrically conductive elastomers and gaskets.
• Multifunction solutions, which blend thermal management, EMI mitigation and mechanical capabilities in a single material.

As part of the expansion of this R&D Center, Laird is also creating an application and testing team to work directly with customers in the lab. Through close collaboration with customers, the team helps them develop, model, and test functionalized materials to improve the performance and reliability of their products.

“Our vision is to turn the expanded Laird R&D center into a place where our scientists work hands-on with customers to diagnose challenges in their products and ensure our innovative solutions address their specific needs,” said Jason Strader, Fellow and leader of the Laird Thermal and EMI Management Solutions R&D Center. “Ultimately, this collaborative process will help customers bring high-performance and reliable products to market even faster.”

About Qnity  
Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ^® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

#   #   #

11/24/25 For further information, contact:
Winnie Chou Interconnect Solutions Technologies Communications Leader
Qnity
winnie.chou@qnityelectronics.com
+886922203452