Qnity Powers Up the Future of High‑Speed Innovation at DesignCon 2026
Press Release | February 23, 2026
Delivering high‑performance materials that enable cutting‑edge designs for AI computing, 5G, robotics, EVs, and more.
WILMINGTON, Del. – February 20, 2026 – Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, will showcase its comprehensive portfolio of advanced materials and solutions at DesignCon 2026, taking place February 25 - 26 in Santa Clara, California. As the leading event for system, board, and chip design engineers, DesignCon remains the destination for those seeking the latest in high‑speed design tools and technologies. Qnity will exhibit at Booth #606.
At the show, Qnity will highlight its advanced packaging and thermal management materials and solutions that enable next‑generation electronic systems with enhanced thermal performance across AI data centers, humanoid robotics, high‑performance flex and rigid PCBs, 5G networks, and other rapidly emerging technologies. The portfolio on display will include Interra™ embedded capacitor laminates, Pyralux® flex circuit laminates and adhesive systems, Kapton® polyimide films, Laird™ thermal interface and EMI shielding solutions, heat sink interface materials and more.
“Through advanced packaging and interconnect solutions and next generation thermal interface and EMI shielding technologies, we help customers design PCBs and systems that are more powerful, faster, and more reliable,” said Chuck Xu, President of Interconnect Solutions at Qnity. “Powered by decades of experience working side by side with leading technology companies, our advanced materials and innovations are pushing the boundaries of speed, power density, and thermal performance. Qnity’s material solutions are engineered to meet these challenges head on.”
Qnity’s Interra™ line includes Interra™ HK04J, a thin, efficient embedded capacitance laminate that enhances power distribution as well as signal integrity and electromagnetic interference in ultra-high-layer count AI PCBs.
Qnity’s Pyralux® flex circuit materials portfolio features low Df flexible copper‑clad laminates, coverlays, and sheet adhesives optimized for high‑speed/high-frequency designs. Qnity’s newest Pyralux® flex circuit coverlays deliver enhanced dimensional stability, low‑ion migration, and exceptional high‑frequency performance. Pyralux® materials incorporate the proven durability of Kapton® polyimide films that deliver reliable performance even under extreme thermal and environmental conditions, supporting high-performance flex architectures.
Qnity’s Laird™ materials portfolios encompass thermal interface, EMI management, and integrated solutions for high-performance AI server platforms, including materials designed to optimize heat sink contact and thermal performance. To address these challenges, leading tech companies partner with Qnity to deploy products such Tgel™ 600 dispensable thermal gel, TPCM™ 7000 phase change thermal interface material, Tputty™ 910 one part liquid dispensable gap filler, MaxAir™ vent panels, and other advanced solutions.
Visitors to Qnity’s booth can also explore interactive displays, including a Mars Perseverance Rover model, satellite prototype, and a cell‑phone teardown station, offering a closer look at how Qnity’s technologies power tomorrow’s most advanced electronics.
Learn more about how Qnity is making tomorrow’s technologies possible at qnityelectronics.com.
Pyralux® flex circuit materials, like the one pictured, have been enabling electronic systems since 1979; from satellites to smartphones, the Mars rovers, and high-speed interconnects.
About Qnity
Qnity™ is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.
Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.
Qnity Media Contact
Ashley Boucher
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