Breakthrough 16 W/mK non-silicone based thermal gap filler for high-performance electronics applications

CLEVELAND, OHIO, Mar 12, 2025 – Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain announced the launch of Laird™ Tflex™ SF16, a next-generation non-silicone based thermal gap filler, delivering industry-leading 16 W/mK thermal conductivity with exceptionally low hardness. This innovation expands Laird’s existing portfolio of advanced electronic materials powering thermal management and signal integrity to meet the evolving demands of AI, data center, automotive, and consumer electronics applications. Laird™ Tflex™ SF16 thermal gap filler provides optimized thermal performance while maintaining reliable gap filling and component protection.

“As power density increases across AI data center, next-gen automotive and advanced electronics, design engineers need innovative thermal interface materials (TIM) that deliver both performance and reliability,” said Chuck Xu, Qnity President, Interconnect Solutions. “Tflex™ SF16 addresses this challenge by combining industry‑leading 16 W/mK thermal conductivity with a soft, non‑silicone based formulation that reduces mechanical stress on sensitive components. With RoHS and REACH compliance built in, Tflex™ SF16 enables customers to advance next‑generation designs while meeting both performance and regulatory requirements.”

Tflex™ SF16 thermal gap filler addresses the need for efficient heat transfer with minimal mechanical stress. Its ceramic-filled, non-silicone based thermoplastic formulation delivers lower thermal resistance and excellent surface wetting even under minimal deflection pressure. The result is a high-conductivity interface material that maintains softness, reliability and compliance under demanding thermal and mechanical conditions.

Laird’s Tflex™ thermal gap pad product family is widely used to deliver high-performance and design flexibility across a broad range of electronic applications. The existing portfolio includes both silicone- and non-silicone based gap fillers, each engineered to balance thermal conductivity, softness, and ease of assembly in both manual and automated manufacturing environments. Non-silicone based variants such as Tflex™ family of gap fillers including SF4, SF7, and SF10, have been widely adopted in AI data center and automotive applications for their clean handling and stable heat transfer performance.

About Qnity  
Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ^® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

For further information, contact:

Ashley Boucher
Global Communications Director
Qnity
ashley.boucher@qnityelectronics.com