The Emblem™ next-generation pad platform is a breakthrough technology for chemical mechanical planarization (CMP) delivering step out performance and enhanced customization for advanced semiconductor manufacturing. Designed to address today’s most pressing needs at advanced nodes, pads in the Emblem™ platform underpin chips for AI, advanced computing‑ and high-bandwidth memory.
At the core of the Emblem™ platform is a fundamentally new technology foundation built on decades of expertise in the mechanisms that drive polishing performance. This next generation CMP technology gives our engineers greater flexibility to design diverse, application‑specific solutions—expanding the CMP toolbox to meet evolving customer requirements across advanced nodes and processes.
Pads from the Emblem™ CMP platform can deliver step out improvement on[ME1] key performance such as high removal rates and ultralow defectivity,‑ without compromising other aspects of CMP performance, and support more sustainable semiconductor manufacturing through longer pad lifetimes and reduced slurry consumption.
The Emblem™ platform is the proud winner of the 2025 Edison Award™ for AI-driven advancements.
Our CMP pads cover a wide range of applications and technology nodes. To further explore Qnity CMP pads, see our overview of the product families by application
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