Qnity to Showcase Advanced Semiconductor and PCB Solutions at productronica 2025

Presenting advanced PCB and IC substrate solutions designed for miniaturization, high performance, and evolving electronic technologies

WILMINGTON, Del. Nov. 17, 2025 – Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, will present its newest high‑performance materials, advanced packaging, and printed circuit board (PCB) solutions at productronica 2025 on November 18‑21, in Munich, Germany.

“At Qnity, we’re enabling our customers’ roadmaps through major ramping technologies that address high-performance computing, advanced interconnect, and signal integrity challenges, powering the next leap in AI, autonomous vehicles, smart devices, and chip manufacturing,” said Thean Ming Tan, Vice President and General Manager, Advanced Flex Technologies, Qnity. “We’re looking forward to connecting with customers and industry leaders at productronica, showcasing how our innovation and leading-edge technologies are making tomorrow’s technologies possible.”

Qnity’s offerings are engineered to meet the demanding requirements of high‑density, high‑frequency, and miniaturized electronic systems, encompassing advanced PCB electroplating, high‑throughput dry film photoresists, high‑reliability dielectrics, flexible circuit materials, and sealing technologies for chip manufacturing equipment. Some of the products that will be featured at the show include:

• Microfill^TM  EVF‑IV acid copper is a new generation via-filling technology designed for fine-line HDI applications suitable for automotive applications. The solution is highly effective for panel deep filling, providing excellent throwing power for improved through-hole performance. 
• Cyclotene^TM dry‑film photo-imageable dielectric is an innovative solution for reliability in advanced semiconductor packaging applications, including glass core substrates.
• Riston^@ DI1600 and DI1600M dry-film photoresists are advanced fine line direct imaging photoresist solutions specifically designed for IC substrate applications. They boast exceptional fine line adhesion and resolution, paired with high-yield performance. 
•  Kapton^@ polyimide films are a versatile material with exceptional thermal stability, chemical resistance, and excellent electrical insulation. Where durability meets versatility, Kapton^® polyimide film is the go-to choice for applications in electronics, aerospace, automotive, rail, medical, and other demanding environments.
• Pyralux^@ ML laminates are a breakthrough in non-copper-based materials, providing OEMs with a reliable, customizable solution for high-performance markets and are becoming essential for the next generation of electronic and thermal management applications.
• Kalrez^@ 9400 sealing solutions, specifically engineered for demanding plasma environments, combines low erosion, minimal particle generation, and exceptional thermal stability—critical attributes for improving semiconductor yield and extending preventive maintenance intervals.

Attendees are invited to stop by booth B3.420 to learn more about Qnity’s portfolio and see its latest solutions in action.

Learn more about Qnity at qnityelectronics.com.

About Qnity

Qnity™ is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Media Contact:
Winnie Chou
+886922203452
Winnie.chou@qnityelectronics.com