|
|
|
Fabric/material |
INNERLAYER BONDING |
|---|---|
|
Design |
CIRCUBOND CLEANER 140 1 |
|
Seam |
CLEANER 140 |
|
Packaging |
HDOW CIRCUIT TECHNOLOGIES |
|
Hazard |
|
|
Coated Material |
PRINTED CIRCUIT BOARDS |
|
Features |
INNERLAYER BONDING |