Kapton® EN

Kapton® EN polyimide film


Kapton® EN polyimide film is a premium dielectric material developed for advanced flexible circuit and interconnect manufacturing. It extends the Kapton® polyimide platform with enhanced processing capability for fine‑feature circuit fabrication. The film is intended to support applications requiring precise dimensional control and reliable performance during circuit manufacturing and end use.

Features & Benefits

  • Used as a dielectric substrate for FPC
  • Superior dimensional stability
  • Lay flat behavior
  • High modulus
  • Coefficient of thermal expansion (CTE) closely matched to copper
  • Suitability for fine-pitch circuitry
  • Very low moisture absorption
  • Laser ablatable film

Applications

  • Flexible printed circuits
  • Fine pitch circuitry
  • Chip scale packaging
  • High density interconnects

Kapton® EN Technical Documents

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    Kapton® EN Product Series Properties

    Property Group Property Name Value Test Method
    Appearance Color Amber
    Classification Functional Film Type CTE matching copper electrical grade film
    Electrical UL Electrical RTI (°C) 240 UL 746B
    Mechanical UL Mechanical Strength RTI (°C) 200 UL 746B
    Regulatory UL Flammability Rating VTM-0 UL-94

    Kapton® EN Product Properties

    Property Name Thickness (μm) Elongation % to Break @23°C Dielectric Strength (kV/mm) CTE (50-200 °C) (ppm/°C) Tensile Strength @23°C (MPa) Tensile Modulus @23°C (GPa)
    Test Method ASTM D5470 ASTM D882 ASTM D149 JIS-K 7197 ASTM D882 ASTM D882
    Kapton® 20EN 5.1 55 400 16 335.0 5.00
    Kapton® 30EN 7.6 60 400 16 350.0 5.30
    Kapton® 50EN 12.7 65 400 16 355.0 5.30
    Kapton® 100EN 25.4 55 380 15 375.0 5.30
    Kapton® 200EN 50.8 70 375 17 345.0 5.30
     
     
     

    Kapton® EN Product Series Documentation

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