Optivision™ CMP Polishing Pads

Optivision™ CMP Polishing Pads

The Optivision™ pad series for chemical mechanical planarization (CMP) is Qnity’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

The latest commercial soft pad for CMP is Qnity’s Optivision™ Max series, engineered with high purity and tightly controlled manufacturing. This precision delivers outstanding defect control, extended pad life, and consistent removal rates—helping customers enable next-generation technologies such as high-bandwidth memory and advanced wafer bonding with reliable, high-performance CMP results.

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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    • Benefits:

      • Improved removal rate and defectivity compared to Politex™ polishing pads
      • Available on multiple substrates
      • Improved lifetime compared to Politex™ pads

      Applications:

      • Copper barrier, buff, polysilicon

    • Benefits:

      • Available with windows to enable endpointing options
      • Delivers the exceptional defect performance within Qnity’s soft pad portfolio
      • Offers longer pad life compared to Politex™ and Optivision™ pads, reducing tool downtime and lowering overall cost of ownership
      • Maintains stable removal rates and defect performance throughout pad life, ensuring consistent CMP results

      Applications:

      • Cu barrier, Cu Bulk, Buff (Oxide, Tungsten)