Optivision™ Max Soft Pad Series

Optivision™ Max Soft Pad Series

The Optivision™ Max series is Qnity’s latest commercial soft pad for chemical mechanical planarization (CMP), engineered with high purity and tightly controlled manufacturing. This precision delivers outstanding defect control, extended pad life, and consistent removal rates—helping customers enable next-generation technologies such as high-bandwidth memory and advanced wafer bonding with reliable, high-performance CMP results.

Applications
  • Cu barrier, Cu Bulk, Buff (Oxide, Tungsten)
 
 
 

Features & benefits

  • Available with windows to enable endpointing options
  • Delivers the exceptional defect performance within Qnity’s soft pad portfolio
  • Offers longer pad life compared to Politex™ and Optivision™ pads, reducing tool downtime and lowering overall cost of ownership
  • Maintains stable removal rates and defect performance throughout pad life, ensuring consistent CMP results
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    Technical Resources
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      Other CMP Applications

      Our CMP pads cover a wide range of applications and technology nodes. To further explore Qnity CMP pads, see our overview of the product families by application