Pyralux® HP

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Pyralux® HP high performance epoxy adhesive


Pyralux® HP high performance epoxy adhesive demonstrating both low loss and high reliability, specifically designed for original equipment manufacturers (OEMs) and printed circuit board (PCB) design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex PCBs in military, telecommunications, automotive and medical applications.

Features & Benefits

  • Excellent electrical performance (low Dk/Df)
  • Robust processability
  • Demonstrated high reliability
  • Designed for extreme PCB applications

Pyralux® HP Technical Documents

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    Pyralux® HP Product Series Properties

    Property Group Property Name Value Test Method
    Dielectric Dielectric Constant (Dk) 10GHz 2.8 ASTM D2520 / IPC-TM-650 2.5.5.3
    Dielectric Constant (Dk) 1MHz 2.7 ASTM D2520 / IPC-TM-650 2.5.5.3
    Dielectric Strength (V/μm) 118 ASTM D149
    Loss Tangent (Df) 10GHz 0.0035 ASTM D2520 / IPC-TM-650 2.5.5.3
    Loss Tangent (Df) 1MHz 0.003 ASTM D2520 / IPC-TM-650 2.5.5.3
    Electrical / Insulation Surface Resistance (Ω) 1x10^9 IPC-TM-650 2.5.17
    Volume Resistivity (Ω・cm) 1x10^10 IPC-TM-650 2.5.17
    Environmental Moisture Absorption (%) <0.4 IPC-TM-650 2.6.2
    Mechanical Elongation at Break (%) 222 IPC-TM-650 2.4.19
    Tensile Modulus (Gpa) 371 Mpa (54ksi) IPC-TM-650 2.4.19

    Pyralux® HP Product Properties

    Property Name Form Factor Package Adhesive Type Adhesive Thickness (μm) Adhesive Thickness (mil)
    HP120000 Sheet adhesive Roll Epoxy 12.0 0.5
    HP250000 Sheet adhesive Roll Epoxy 25.0 1.0
    HP500000 Sheet adhesive Roll Epoxy 50.0 2.0