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Pyralux® HT high temperature polyimide bonding film features a thermoplastic polyimide composition that is suitable for application either as a coverlay to protect surface circuitry or bond ply for multilayer flex and rigid-flex applications. This stand-alone film exhibits low loss characteristics for high performance applications. Pyralux® HT can be used in conjunction with all-polyimide Pyralux® clads to afford a robust circuitry solution for applications requiring high operating temperature performance, excellent signal integrity, and high reliability.
| Property Group | Property Name | Value | Test Method |
|---|---|---|---|
| Dielectric | Dielectric Constant (Dk) 10GHz | 3.2 | ASTM D2520 / IPC-TM-650 2.5.5.3 |
| Dielectric Constant (Dk) 1MHz | 3.2 | ASTM D2520 / IPC-TM-650 2.5.5.3 | |
| Dielectric Strength (V/μm) | 161 - 275 | ASTM D149 | |
| Loss Tangent (Df) 10GHz | 0.0015 | ASTM D2520 / IPC-TM-650 2.5.5.3 | |
| Loss Tangent (Df) 1MHz | 0.0015 | ASTM D2520 / IPC-TM-650 2.5.5.3 | |
| Environmental | Moisture Absorption (%) | 0.8 | IPC-TM-650 2.6.2 |
| Mechanical | Elongation at Break (%) | 170 | IPC-TM-650 2.4.19 |
| Tensile Modulus (Gpa) | 2.8 | IPC-TM-650 2.4.19 |
| Property Name | Form Factor | Package | Adhesive Type | Adhesive Thickness (μm) | Adhesive Thickness (mil) |
|---|---|---|---|---|---|
| HT0100 | Bonding Film | Roll | Adhesive-less all polyimide | 25.0 | 1.0 |
| HT7049 | Bonding Film | Roll | Adhesive-less all polyimide | 38.0 | 1.5 |
| HT0200 | Bonding Film | Roll | Adhesive-less all polyimide | 50.0 | 2.0 |
| HT0300 | Bonding Film | Roll | Adhesive-less all polyimide | 75.0 | 3.0 |