✕
✕
To access secured content from DuPont Please Sign In or Sign Up below
Pyralux® TFH all-polyimide double-sided copper-clad laminate features an adhesiveless, all-polyimide dielectric layer and a copper foil optimized for minimal insertion loss. This material exhibits excellent low loss performance, enabling remarkable signal integrity in high-speed digital and high-frequency circuit applications. Offered in a variety of both dielectric and conductor thickness.
| Property Group | Property Name | Value | Test Method |
|---|---|---|---|
| Dielectric | Dielectric Constant (Dk) 10GHz | 3.2 | ASTM D2520 / IPC-TM-650 2.5.5.3 |
| Dielectric Strength (V/μm) | ASTM D149 | ||
| Loss Tangent (Df) 10GHz | 0.003 | ASTM D2520 / IPC-TM-650 2.5.5.3 | |
| Electrical / Insulation | Surface Resistance (Ω) | >1x10^15 | IPC-TM-650 2.5.17 |
| Volume Resistivity (Ω・cm) | >1x10^16 | IPC-TM-650 2.5.17 | |
| Environmental | Moisture Absorption (%) | 0.5 | IPC-TM-650 2.6.2 |
| Mechanical | Elongation at Break (%) | 45 | IPC-TM-650 2.4.19 |
| Tensile Modulus (Gpa) | >7 | IPC-TM-650 2.4.19 |
| Property Name | Form Factor | Package | Adhesive Type | Copper Thickness (μm) | Copper Thickness (oz) | Copper Type | Dielectric Thickness (μm) | Dielectric Thickness (mil) |
|---|---|---|---|---|---|---|---|---|
| TFH122512 | Double-sided FCCL | Roll | Adhesive-less all polyimide | 12 | 0.33 | RA or ED | 25.0 | 1.00 |
| TFH122512C | Double-sided FCCL | Roll | Adhesive-less all polyimide | 12 | 0.33 | RA or ED | 25.0 | 1.00 |
| TFH125012 | Double-sided FCCL | Roll | Adhesive-less all polyimide | 12 | 0.33 | RA or ED | 50.0 | 2.00 |
| TFH182518 | Double-sided FCCL | Roll | Adhesive-less all polyimide | 18 | 0.50 | RA or ED | 25.0 | 1.00 |
| TFH185018 | Double-sided FCCL | Roll | Adhesive-less all polyimide | 18 | 0.50 | RA or ED | 50.0 | 2.00 |