Pyralux® TK

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Pyralux® TK Kapton® & fluoropolymer bond ply


Pyralux® TK Kapton® & fluoropolymer bond ply features Kapton® polyimide film, coated on both sides with a proprietary B-staged modified acrylic adhesive. This bond ply can be used to encapsulate etched details for environmental protection and electrical insulation. Using bond ply can eliminate a layer of Kapton® dielectric and a layer of adhesive in low-layer count multilayer constructions.

Features & Benefits

  • Fluoropolymer film provides low-loss dielectric constant loss tangent
  • Low moisture absorption for consistent performance
  • Designed for use with Pyralux® TK Kapton® & fluoropolymer double-sided copper-clad laminate

Applications

  • Encapsulation of etched circuitry in flex circuits
  • Encapsulation of etched circuitry in rigid flex circuits
  • Bond ply for low layer count multilayer flex constructions
  • Dielectric bonding layers in high frequency flex circuits

Pyralux® TK Technical Documents

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    Pyralux® TK Product Series Properties

    Property Group Property Name Value Test Method
    Dielectric Dielectric Constant (Dk) 10GHz 2.3 Normal, 2.6 In-plane ASTM D2520 / IPC-TM-650 2.5.5.3
    Dielectric Strength (V/μm) 190 ASTM D149
    Loss Tangent (Df) 10GHz 0.0015 ASTM D2520 / IPC-TM-650 2.5.5.3
    Environmental Moisture Absorption (%) 0.3 IPC-TM-650 2.6.2

    Pyralux® TK Product Properties

    Property Name Form Factor Package Adhesive Type Dielectric Thickness (μm) Dielectric Thickness (mil) Adhesive Thickness (μm) Adhesive Thickness (mil)
    TK252525 Bond ply Roll Polyimide 25.0 1.00 25.0 1.0
    TK255025 Bond ply Roll Polyimide 25.0 1.00 50.0 2.0
    TK445044 Bond ply Roll Polyimide 44.0 1.75 50.0 2.0