Riston® FX950

Riston® FX950

Printed circuit board fabricators face increasing challenges to produce fine lines at high yields, while cost effectively handling harsh selective metallization processes. Qnity has developed the Riston® FX Series of photoresists to help fabricators address these issues.

Applications
  • Compatible with acid copper, tin, tin/lead, nickel sulfamate and acid gold electrolytic plating baths.
  • Ideal for use with very thin-core laminate, including flexible and flex/rigid substrates.
  • Negative working, aqueous processable dry film photoresist.
  • Suitable for print-and-etch and tent-and-etch applications with acid and alkaline etchants.
  • Very high resolution capability with wide processing latitude.
Recommendations
  • 3F or 4F grade, fused pumice at 15-20 % v/v, 9-12 mm (3/8-1/ 2") brush foot print, fines removal and replenishment per vendor recommendations; high pressure (10 bar) final rinse (pH 6-8); hot air dry.
  • 3F or 4F grade, unfused pumice, 15-20 % v/v, fines removal and replenishment per vendor recommendations; high pressure 10 bar (147 PSI) final rinse (pH 6-8); hot air dry
  • Always allow enough time for panels to cool to room temperature prior to exposure to avoid phototool size changes (about 15 minutes). Use a panel accumulator with in-line systems
  • Develop-to-Rinse Length Ratio: 2:1 minimum.
  • Dry lamination maximum recommended hold time = 3 days.
  • Drying: Fluid head or hot air turbine drying is preferred.
  • Minimize hold time for best tenting performance.
  • Rinse spray pressure: 1.4-2.4 bar (20-35 psig). Use high impact , direct-fan nozzles.
  • Rinse temperature: 21-25°C (70-80°F)
  • Rinse water hardness: 150-300 ppm CaCO3 equivalent. Softer water can be hardened by the addition of magnesium sulfate (Epsom salts).
  • Use 500 grit with a 7-9 mm (1/4 - 3/8") brush foot print and a high pressure (8-10 bar) pH 6-8 final rinse.
  • Use 500 grit with a 7-9 mm (1/4 - 3/8") brush footprint and a final rinse @ 2-3 bar @ pH 6-8.
  • Wet lamination maximum recommended hold time = 24 hours.
Solutions
  • Additives for foam control may not be required depending on equipment design and operation. However, if defoamer is needed, use 0.8 ml/ liter (3 ml/gallon) for resist loading up to 0.6 mil-m2/liter (25 mil-ft2/gal).
  • Batch: up to 0.5 mil-m2 /liter (20 mil-square feet/gallon). Maintain breakpoint at <50% by lowering conveyor speed or by starting batch stripping with a lower breakpoint and changing the solution once breakpoint moves above 50%.
  • Dry Film Photoresist
  • Feed & Bleed: To keep loading at about 0.25 mil-m2 l (10 milft2/gal), activate addition of fresh developer at pH 10.6; stop addition when pH 10.8 is reached. Thus, the pH controller set point = 10.7.
  • Filtration Systems Spray stripping equipment should contain a filtration system to collect and remove resist skins to avoid nozzle clogging, to extend stripper life, and to avoid resist skins from reaching the rinse chamber.
  • For batch processing: Adjust conveyor speed to maintain desired breakpoint; dump developer solution when development time becomes 50% longer than with a fresh solution.
  • However, low breakpoints can lead to attack of solder or tin on plated work, or cause copper oxidation on print-andetched or tent-and-etch panels.
  • Preferred: Continuous replenishment (feed & bleed) using board counter. Maintain resist loading at < 0.4 mil-m2/liter (< 15 mil-square feet/ gallon).
  • The most effective filter systems collect the resist skins continuously off-line, immediately after they were generated and before entering recirculation pumps.
 
 
 

Features & benefits

  • Chemical Cleaned RTF Copper Foil
  • Chemical Cleaned Standard Copper Foil or Panel-Plated Copper
  • Clean processing with patented sludge-free formulation technology 
  • Double-Treated Copper Surfaces
  • Electrochemically Cleaned Copper
  • Excellent conformation and adhesion 
  • Multifunctional capabilities - ideal for all fine line work, etching and plating 
  • Riston® FX900 is the superior film for fine-line printed circuit boards. This film offers the fabricator:
  • Superior resolution for precise imaging of complex high value circuit designs to to 10 µm 
    		•
    Unscrubbed Electroless – Post-Electroless Process:
  • Acid Neutralization – 5% sulfuric acid for 5 minutes.
  • Antitarnish – 5 minutes; tank must have a recirculation pump and 10-micron filter. Recommended/Tested Antitarnishes: Duratech Antiox PC-C & PC-L and Enthone Entek Cu-56.
  • DI Final Rinses – 2 reverse-cascade overflow at 35-40C (95-105F) at 2-3 gpm at pH 6-8
  • Drag-Out Rinses – 2 reverse-cascade overflow tanks for 2 minutes each OR single spray tank for 30 seconds and single overflow tank for 2 minutes.
  • Fluidhead Turbine Dryer (for high-aspect-ratio platedthrough-holes and/or horizontal lines).
  • Heated Rinse (Optional) – 50-55C (120-130F) for 3 minutes.
  • On-Line Box Turbine Dryer – 5-10 minutes at 55-65C (130- 150F).
  • Water Rinse – 2 minutes (optional if antitarnish is sulfuric acid-based).
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    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    13756 0 0 0
    18406 0 0 0
    13950 0 0 0
     
     
     

    Physical Properties

    Property Value Unit Method
    Exposure Energy RST-25 SST-21 mJ/cm2 50-140
    3.0 wt% NaOH — (riston-1) — 85 sec
    1.5 wt% NaOH — (riston-1) — 125 sec
    Exposed Color in Daylight — (riston-1) — Dark Green
    Lam. Roll Pressure ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 3.0-5.0 bars (43-72 psig)
    Seal Time ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 1.5-2.5 seconds
    Pre-Heat HRL Hot Roll Laminators — panels > 0.6 mm (> 25 mils) thick
    Seal Bar Pressure ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 2.5-4.5 bars (36-65 psig)
    Odor — (riston-1) — Low
    Air Assist Pressure HRL Hot Roll Laminators — 0-2.8 bar (0-40 psig)
    Exposed Color in Yellow Light — (riston-1) — Dark Blue
    Print-Out (Phototropic) Image — (riston-1) — Strong
    Unexposed Color in Yellow Light — (riston-1) — Light Green
    Roll Speed ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 1.5-3 m/min (5-10 ft/min)
    HRL Hot Roll Laminators — 0.6-1.5 m/min (2-5 ft/min)
    Seal Bar Temp ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 50-60°C (120-140°F)
    Roll Temperature HRL Hot Roll Laminators — 105-120°C (220-250°F)
    ASL/CSL/DFL Automatic/Cut Sheet/Dry Film Laminators — 105-120°C (220-250°F)
    Contrast to Copper — (riston-1) — Strong
    Resist Thickness — (riston-1) — 20, 30, 38, 50 & 62 μm (0.8, 1.2, 1.5, 2.0 & 2.5 mils)
    Na2CO3•H2O — (riston-1) lb wt% x sump volume in gallons x 0.10
    — (riston-1) kg wt% x sump volume in liters x 0.012
    Qnity D4000 K2CO3 liquid (40% concentrate) — (riston-1) liters wt% x sump volume in liters x 0.018
    — (riston-1) gallons wt% x sump volume in gallons x 0.018
    Spray Pressure — (riston-1) — 2.0-2.4 bar (30-35 psig)
    Temperature — (riston-1) — 24 -30C (75-85F)
    K2CO3 — (riston-1) kg wt% x sump volume in liters x 0.01
    — (riston-1) lb wt% x sump volume in gallons x 0.083
    Na2CO3 — (riston-1) lb wt% x sump volume in gallons x 0.083
    — (riston-1) kg wt% x sump volume in liters x 0.01
    Chemistry — (riston-1) — 0.7-0.8 wt%; 0.75 wt%
    Spray Nozzles — (riston-1) — High-impact direct-fan nozzles
     
     
     
    Product Details

    Fabric/material

    TOWANDA FLAMMABLE

    Design

    FX950

    Seam

    FX900

    Packaging

    FX950

    Hazard

    Coated Material

    PRIMARY IMAGING FILM

    Features

    CI-CONVENTIONAL
     
     
     
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