Stackplane™ CMP Slurries for Advanced Packaging

Stackplane™ CMP Slurries for Advanced Packaging
CMP slurry solutions engineered for the next generation of advanced packaging

The Stackplane™ slurry platform is designed to address the diverse chemical mechanical planarization (CMP) requirements of advanced packaging applications. Supporting the industry's transition from traditional scaling to shrink-and-stack architectures, the Stackplane™ platform combines proven and next-generation slurry technologies for hybrid bonding, through-silicon vias (TSVs), polymer materials, and emerging packaging substrates and architectures. Combining proven performance with next-generation innovation, Stackplane™ slurries enable precise planarization, process selectivity, and manufacturing reliability across both wafer-level and die-level processes.

Product families

• Stackplane™ SP1000 and SP2000 series for hybrid bonding 

• Stackplane™ SP3000 series for TSV applications 

• Stackplane™ SP4000 series for polymer CMP 

• Stackplane™ SP5000 series for emerging technologies including panel-level through-glass vias (TGVs), glass substrates, and next-generation materials.

Features & benefits

• Comprehensive CMP slurry platform supporting hybrid bonding, TSV integration and next generation advanced packaging requirements
• Designed for consistent planarization performance across wafer-level and die-level processes
• Optimized selectivity with topography control for the diverse materials and structures in advanced packaging
• Supports manufacturing reliability for increasingly complex packaging architectures
• Complemented by Qnity's CMP pads and post-CMP (PCMP) cleans solutions as part of a robust advanced packaging portfolio