The Visionpad™ pad series for chemical mechanical planarization (CMP) is a platform designed for multiple applications and advanced nodes. Visionpad™ technology is engineered with unique polymer chemistry, including optimized pore size and porosity levels. This leads to a range of polishing performance options depending on process requirements.
The Visionpad™ 3000 series of polishing pads is designed to achieve the defect levels of the Politex™ pad with the pad planarization capabilities of the IC1000™ pad in copper barrier processes. The Visionpad™ 3000 series has a softer surface than an IC1000™ pad for improved defectivity performance, while maintaining a high stiffness to provide superior planarization.
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The Visionpad™ 5000 series is designed for use in oxide and tungsten applications. Visionpad™ 5000 series pads exhibit predictable pad-to-pad performance, offer stable operation throughout the process, and demonstrate a similar or increased pad life when compared to IC1000™ pads.
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The Visionpad™ 6000 series of polishing pads is designed to significantly improve defectivity and dishing performance as well as extend the pad lifetime compared to IC1000™.
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The Visionpad™ 7000 series of polishing pads is designed to significantly improve lifetime compared to IC1000™.
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The Visionpad™ 9000 series of polishing pads is designed to reduce defectivity and dishing as well as extend the pad lifetime compared to IC1000™.
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