Inside TPCA Show 2026
Powering the Next Leap in Electronics
October. 20-22, 2026 | Taipei Nangang Exhibition Center, Taiwan
Qnity Booth: L213, 4F, TaiNEX 1
Meet Qnity at TPCA Show 2026 to explore how our advanced materials and end-to-end solutions help drive innovation in AI, high-performance computing, advanced packaging and connectivity, and thermal management.
Our experts will be present at the booth to share their extensive knowledge and insights into technological advancements and industry trends.
9:30-17:00, October 20-21
9:30-15:30, October 22
IMPACT Conference Taiwan 2026
Qnity Session: Enable Energy Efficient AI Technologies Through Integrated Material Solutions
10:10-12:10, October 20
Venue: 701A, 7F, TaiNEX 2
Agenda
10:10-10:20
Opening
Lucy Wei
Senior Director, Global Metallization Segment
Advanced Circuit & Packaging, Qnity
10:20-10:50
Thermal Challenges and Materials Solutions for Advanced Package in the AI Era
Joungphil Lee
Principal Engineer, Technical Leader
Samsung Electronics
10:50-11:20
Material Innovations Empowering Megawatt AI Data Centers: The Synergy of Advanced Packaging, CPO, and VPD Architecture
Scott Chen
Senior Vice President
ASE Inc.
11:20-11:45
Advanced Copper Metallization Solutions for AI-Driven HDI
Tim Lin
Lab Innovation Lead for Electroplating
R&D, Qnity
11:45-12:10
Enhancing Thermal Performance for Thin, High-Power PCBs for AI Data Centers
Jake Joo
Global Technology Director
Advanced Flex Technologies, Qnity
Additional Opportunities to Engage with Qnity
【S28】High-Speed AI and Data Center PCB Technology
Reliable Metallization of Quartz Fiber M9 Laminates via Advanced Electroless Copper Chemistry for Next-Gen AI/HPC PCBs
11:10-11:25, October 21
Venue: 703, 7F, TaiNEX 2
Jason Chang
RD Chemist, Qnity
TPCA Show Forum: AI-Driven Global Strategy and Market Trends
13:30-15:00, October 21
Venue: L1409 (Main Stage), 4F, TaiNEX 1
Chuck Xu
President
Interconnect Solutions, Qnity
Explore how Qnity’s advanced packaging materials and process capabilities power the stack
Explore how Qnity's advanced packaging materials and process capabilities power next-generation semiconductor integration, AI computing, and heterogeneous packaging.
Explore how Qnity’s advanced interconnect innovations enable the next-generation AI
Explore our advanced computing and AI solutions and discover what’s possible
Discover innovative products and solutions that powering performance through heat management and reliability
Explore Our Thermal Content Hub
What you’ll find in the hub:
· Case studies from hyperscale data centers, optical interconnects, and wearable devices
· A video overview of our thermal portfolio
· Direct links to brochures, detailed product pages, and application notes
Explore our thermal content hub and discover resources for your thermal management needs .
For media interviews or any media-related inquiries:
Ashley Boucher
Director, Communications
ashley.boucher@qnityelectronics.com
or
Winnie Chou
Director, Global Communications, Interconnect Solutions
Corporate Communications, Asia Pacific
winnie.chou@qnityelectronics.com
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.