Scaling alone no longer defines progress, as innovation increasingly comes from materials, design, and advanced packaging. From wafer processing to interconnects to thermal management and beyond, discover how we’re making next-generation advanced packaging applications possible.
Artificial intelligence, hyperscalers, cloud and edge computing, and advanced networking are driving new system integration requirements—positioning advanced packaging as a critical enabler for next-generation high-performance computing.
From shrink to stack
As High Bandwidth Memory (HBM), 2.5D and 3D stacking and heterogenous integration shift designs toward complex vertical architectures, chip designers must move beyond conventional packaging to scale chip-to-chip interconnects, and enable larger, heterogeneously integrated systems. Key challenges in cost, power delivery, thermal dissipation, and high bandwidth connectivity must be addressed to unlock advanced silicon architectures for modern compute workloads.
As stack heights increase and architectures become more complex, our materials enable high vertical density and data bandwidth while supporting reliable, high-yield fabrication across silicon, organic, and glass platforms at both wafer and panel scale.
Solutions for next-gen designs
Our wafer packaging technologies including through‑silicon vias (TSV), fine pitch microbumps, dense redistribution layers (RDL), and copper pillars for hybrid bonding support next-generation advanced packaging. These capabilities enable processes such as wafer thinning, metallization of through-glass vias (TGV) and 3D stacking with hybrid bonding.
We offer a differentiated platform across the full design-to-assembly packaging ecosystem, spanning materials for wafer processing, advanced interconnects, fine-feature photoresists and thermal management. Together, these technologies support High Bandwidth Memory (HBM), interposers , bonding and assembly, and IC substrates, addressing escalating demands for power efficiency, thermal performance, signal integrity and long-term reliability. Explore each of these areas by clicking through the illustration above.
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