Ancillary Lithography Materials

 
 
 

Enhancement Chemistries to Support a Total Lithography Solution

Qnity’s roots run deep in its production-proven line of ancillary lithography products. From organic and inorganic developers to a full suite of removers, strippers, and edge-bead solvents and cleaning products, our formulations stand the test of time and provide customers with a complete solution across the spectrum of lithography processes.

Qnity’s global manufacturing and support footprint make these low-cost solutions easily accessible.  

 
 
 

  • Our developers are designed to be application-specific and to suit customer preferences.Choose from our metal ion free (MIF) organic and metal ion bearing (MIB) inorganic developers that come in a variety of formulations including:

    • MIB inorganic developers
    • MIF organic developers
      • Surfactant-aided
      • Low-foaming
      • Surfactant-free versions
    • Pre-blended formulations provide ease-of-use and added safety benefits
    • Concentrated forms available for use with automated dilution systems. 

  • Filtered and processed to ensure the highest purity solvents, our removers and strippers create clean lines prior to photoresist deposition. This results in low defects, even at advanced technology nodes.

    • Bulk removers are available for immersion or batch spray
    • Post-etch residue removers are available for immersion, batch spray, or single wafer processing

    Qnity offers a complete line of supporting chemistries formulated as companions to our photoresists, to cover multiple facets for different processing conditions. These include:

    • Fluorine-based post-etch residue remover
    • FST™-M protective wafer coat for improved post-strip handling
    • Proprietary lift-off layer process for trench metallization without CMP
 
 
 

Lithography Materials 

 
 
 

  • Ancillary Lithography Materials

    Qnity’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

  • Advanced Overcoats

    Used in conjunction with photoresists, Qnity’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

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  • Functional Sublayers

    Functional sublayer materials enabling advanced DUV, ArF, and EUV patterning for logic and memory devices

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  • Photoresists

    Qnity’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

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    Eon™ photoresists for extreme ultraviolet (EUV) lithography provide robust, high-resolution patterning for contact hole and line and space features, optimized specifically for next-generation DRAM memory and logic EUV manufacturing processes.

    Epic™ photoresists are a series of resists widely used for 193 nm (ArF) processes with and without topcoats. Epic™ IM photoresists are designed for the unique environment created by immersion lithography, in which water between the lens and the wafer enables exposure of finer patterns.

    Our Microposit™ g-line (436nm) and Megaposit™ i-line (365nm) and photoresists deliver reliable, high-precision patterning solutions for a wide range of semiconductor and electronic device manufacturing processes.

    Our UV™ KrF photoresists, designed for 248nm excimer laser lithography, deliver superior resolution and process reliability for advanced semiconductor manufacturing.
 
 
 
 
 
 

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