Qnity Wins 2026 Edison Award for Emblem™ Next-Generation CMP Pad Platform
Press Release | April 20, 2026
Recognizing breakthrough innovation powering advanced-node semiconductor manufacturing
WILMINGTON, Del., April 20, 2026 – Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced that its Emblem™ pad platform for next-generation chemical mechanical planarization (CMP) has won the 2026 Edison Award™ in the commercial technology category. This marks the second consecutive year Qnity’s CMP solutions have earned the Edison Award™, underscoring the company’s leadership in innovation for advanced-node semiconductor manufacturing.
Qnity was recognized for the Emblem™ 506X CMP pad, a new offering designed to meet the growing performance and sustainability demands of advanced semiconductor applications for AI, high-performance computing, and advanced connectivity. The first product introduced in the Emblem™ platform, the Emblem™ 5171X CMP pad, earned the award in the AI-driven advancements category in 2025.
“Innovation at advanced nodes requires new approaches to materials design. The Emblem™ CMP platform reflects how we’re applying deep scientific understanding and customer collaboration to solve increasingly complex challenges and enabling the next generation of semiconductor technologies,” said Randal King, Ph.D., Chief Technology and Sustainability Officer, Qnity.
The Emblem™ platform uses a new technology foundation built on decades of expertise in the mechanisms that drive polishing performance, equipping Qnity with expanded capabilities for pad design. Emblem™ 506X CMP pads are designed to meet the dual demands of advanced-node CMP performance and sustainability, delivering higher removal rates, fewer defects, longer pad life, and a low-chlorine composition. Validated through close collaboration and multiple customer adoptions, they help fabs achieve predictable yield and efficiency without performance tradeoffs.
The Edison Awards™ is an annual global competition recognizing excellence in innovation across new product and service development, marketing, and human‑centered design. Winners were selected from thousands of submissions worldwide and honored for their impact at the Edison Awards Gala in Fort Myers, Florida, on Thursday, April 16, 2026.
To learn more about innovation in CMP solutions from Qnity, interested parties should contact their account manager or submit an inquiry at qnityelectronics.com.
Qnity team members attending the 2026 Edison Awards™ Gala in Fort Myers, Florida, where the company’s Emblem™ next‑generation CMP pad platform was recognized.
About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.
Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.
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