Emblem™ 5060H and 5061H are advanced polishing pads for chemical mechanical planarization (CMP) from the Emblem™ CMP platform, designed to deliver high removal rates and low defectivity across multiple semiconductor applications. Built on Qnity’s novel modulated supramolecular technology, these pads provide a tunable, sustainable solution that minimizes traditional CMP tradeoffs while enabling faster optimization for diverse customer requirements.
Emblem™ 5060H/5061H pads support next‑generation manufacturing with improved efficiency, lower cost of ownership, and reduced environmental impact.
Our CMP pads cover a wide range of applications and technology nodes. To further explore Qnity CMP pads, see our overview of the product families by application