Emblem™ 5171X CMP pad for tungsten

Emblem™ 5171X CMP Pad

Emblem™ 5171X polishing pad for chemical mechanical planarization (CMP) is the first product available from the Emblem™ CMP pad family, delivering next-generation, step out performance for tungsten (W) CMP through novel modulated supramolecular  technology—enabling higher throughput, lower defectivity, and faster process placement with minimal tradeoffs.

Applications
  • Tungsten (W) CMP processes
  • Advanced semiconductor manufacturing requiring high throughput and low defectivity
  • Applications demanding rapid process placement with minimal tuning
Benefits
  • Up to 30% higher removal rates with 20% lower defectivity, plus an additional 10% removal rate gain from advanced groove design
  • Supports 2-platen to 1-platen processing for higher productivity
  • Faster optimization with reduced tuning and conditioning requirements
  • Long pad life, uniform porosity, and disk life improved by more than 2x
  • Higher throughput and extended consumable life reduce slurry and disk consumption
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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    Other CMP Applications

    Our CMP pads cover a wide range of applications and technology nodes. To further explore Qnity CMP pads, see our overview of the product families by application