ICPT International Conference on Planarization/CMP Technology 2026
October 19 – 22
Seoul, South Korea
Qnity is proud to sponsor ICPT 2026. Visit us to meet our experts and join our technical presentations to learn how we are driving advances in semiconductor manufacturing through CMP innovations that improve yield, reduce defects, and enable next-generation device architectures.
October 20 (Tue): 08:30 - 18:00
- October 21 (Wed): 08:30 - 18:00
- October 22 (Thu): 08:30 - 13:00
From Materials to Insight: Enabling the Next Generation of Semiconductor Innovation
Luncheon Keynote Speech
Julia Woertink VP of Technology, Semiconductor Technologies at Qnity
October 20, 2026 | 12:55
Advanced Tungsten Slurry with Low Etching Rate, High W / Oxide Selectivity, and E-O-E Free Topography
Allison Hsu
October 20, 2026 | 10:40–11:00
Qnity Cu PCMP Technology Evolution from Mature to Advanced Node
Ping Hsu
October 21, 2026 | 11:25–11:50
October 21, 2026 | 13:00 – 15:10 | Gallery 1F
[P-044] Metal Compatible Ceria Post-CMP Cleans
Volley Wang
[P-047] A Predictive AFM Adhesion Force Method for PCMP Cleaning Efficiency
Ray Chen
[P-049] Electrochemical and Q-Time Integrated Methodology for Screening Cu Surface Stability in Post-CMP Cleaning
Fred Huang
[P-052] Ceria-Induced Particle Defects Formation and a New Post-CMP Cleaning Strategy to Improve Yield
Shu-Yi Meng
[P-053] Mechanism Study of pH Shock Effect for Organometallic Residue Formation in PCMP Process
Jacky Cheng
[P-062] Semi-Automated Topography Analysis for Post-CMP Surface Planarity Assessment
Daniel Chang
[P-078] Oxidation-Selective Chemically Controlled CMP Strategy for Molybdenum-Tungsten Integration in Advanced MOL Contacts
James Hsu
[P-115] Effects of Material Removal Rate on Scratch Defects in Bulk Cu CMP
Te-Chun Wang
[P-119] Control of Edge Profile Asymmetry During CMP
Da-Shiuan Chiou
Driving advances in semiconductor manufacturing through CMP innovations
CMP Pads
• Emblem™ pad family for advanced nodes
• Ikonic™ and Visionpad™ pad families for multiple CMP applications
• IC1000™ polishing pads—the industry standard for CMP
• Politex™, Suba™ and Optivision™ soft pads
CMP Slurries
• Optiplane™ and Klebosol® dielectric slurries
• Acuplane™ and Machplaner™ slurries for advanced packaging and copper barrier
• Novaplane™ tungsten slurries
• Nanopure™ wafer polishing slurries
PCMP Cleans
• PCMPSolv™ PCMP cleans for copper, cobalt, tungsten, molybdenum, poly silicon and TSV processes
For more information and to connect with Qnity while at ICPT, please contact us here.
For more information about ICPT, please visit the ICPT website.
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