Qnity’s family of adhesives and dielectrics provide leading-edge permanent bonding materials solutions to meet key requirements for today’s high-density, thinner packages used in mobile products and high-performance computing.
Qnity’s permanent bonding materials for 3DICs, memory stacks, image sensors, and MEMS applications:
Permanent bonding materials are adhesives and dielectrics used to assemble IC logic chips, memory chips, image sensor devices, microelectromechanical systems (MEMS) devices, and more into high-density heterogeneously-integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.
When building today's high-density, thinner electronics packages, semiconductor device manufacturers rely on permanent bonding materials for stacking chips using either chip-to-wafer or wafer-to-wafer stacking processes
Qnity delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Qnity’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to Qnity for extraordinary solutions.
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.
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and solve the challenges of our time.