Introduction to chemical mechanical planarization
Inside SEMICON Taiwan 2026
Powering the Next Leap in Electronics
September 2–4, 2026 | Taipei Nangang Exhibition Center, Taiwan
Qnity Booth: TaiNEX 2, 4F, Materials Pavilion , Booth S7930
Meet Qnity at SEMICON Taiwan 2026 to explore how materials innovation, system-level performance, and collaboration help enable breakthroughs across AI, advanced computing, and advanced connectivity.
Schedule a meeting | Contact our team
Keynote Speech at CEO Summit
Shrink and Stack: Redefining Semiconductor Innovation in the Angstrom Era
Speaker: Jon Kemp, CEO, Qnity
Date & Time: Tuesday, September 2 | 11:00 - 11:25 AM
Location: 701AB (Future Stage), 7F, TaiNEX 2
Technical Forum
IC Forum- Advanced Chip Technology and Manufacturing
Advanced CMP Pad Engineering for Enabling Next-Generation AI Chip Planarization
Speaker: Dr. Ivan Li, R&D Global Technical Leader, CMPT Asia Technology Center, Qnity
Date/Time: Monday, August 31 | 2:50 - 3:15 PM
Location: Platinum Ballroom C, 3F, Grand Hilai Taipei
Heterogenous Integration Global Summit 2026 – Day1
Integrated Metallization, Bumping, and Fine-Line Patterning for AI-Driven Packaging
Speaker: Dr. Steven Lin,Global Marketing Director, Advanced Packaging Metallization, Advanced Circuit & Packaging, Qnity
Date/Time: Tuesday, September 1 | 10:05 - 10:30 AM
Location: Grand Ballroom, 3F, Grand Luxe Banquet
Strategic Materials Conference Taiwan
Next-Generation Solder Plating Chemistry for Optimizing Post Reflow Coplanarity in Mixed Feature Die Designs
Speaker: Dr. Cara Gannett, Senior Scientist, Advanced Circuit & Packaging
Date/Time: Thursday, September 3 | 2:15 - 2:35 PM
Location: 701AB (Future Stage), 7F, TaiNEX 2
Additional Opportunities to Engage with Qnity
Materials Tech xPOT
Next-Generation Slurries for Advanced Packaging
Speaker: Allison Hsu, Taiwan Slurry R&D Manager, Qnity
Date/Time: Wednesday, September 2 | 1:20 -1:40 PM
Location: TechXPOT Stage, Area L Lobby, TaiNEX 1, 4F
End of Day Happy Hours
Join the Qnity team at our booth for a happy hour gathering at the end of each day. Enjoy light snacks, beverages, and networking in a relaxed, casual setting.
Date/Time:
September 2-3 | 3:00 - 4:00PM
September 4 | 2:00 - 3:00 PM
Location: Qnity booth S7930
Dream Fab Display
See Qnity technologies on display at the Dream Fab Showcase throughout the show.
Exclusive Time Slot for Qnity
September 2-3 | 4:20 - 4:30 PM
September 4 | 11:00 - 11:10 AM
Location: Dream Fab, TaiNEX 1 Main Entrance
Discover Innovative Products and Solutions for Advanced Semiconductor Manufacturing
Explore Qnity's latest innovations, industry recognition, technical expertise, and reliability solutions designed to advance semiconductor manufacturing performance and sustainability.
Optivision™ Max CMP pad family
Optivision™ Max CMP pad family
Learn More
Emblem™ next-generation CMP pad family – winner of 2026 Edison Award
Emblem™ next-generation CMP pad family – winner of 2026 Edison Award
Learn More
Epic® and UV™ non-fluorine photoresists
Epic® and UV™ non-fluorine photoresists
Learn More
Eon™ photoresists and AR™ underlayers – expanded offerings for EUV lithography (
Eon™ photoresists and AR™ underlayers – expanded offerings for EUV lithography (
Learn More
New PCMPSolv™ clean for ceria applications
New PCMPSolv™ clean for ceria applications
R&D 100 Award for sustainable photoresists
R&D 100 Award for sustainable photoresists
Product Literature
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The Kalrez® parts are designed for reliability in the most extreme conditions.
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Explore how Qnity’s advanced packaging materials and process capabilities power the stack
Explore how Qnity's advanced packaging materials and process capabilities power next-generation semiconductor integration, AI computing, and heterogeneous packaging.
Discover innovative products and solutions that powering performance through heat management and reliability
Explore Our Thermal Content Hub
What you’ll find in the hub:
· Case studies from hyperscale data centers, optical interconnects, and wearable devices
· A white paper on gap pad recovery/rebound and thermal contact optimization
· A video overview of our thermal portfolio
· Direct links to brochures, detailed product pages, and application notes
Product Literature
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For media interviews or any media-related inquiries:
Ashley Boucher
Director, Communications
ashley.boucher@qnityelectronics.com
or
Winnie Chou
Director, Global Communications, Interconnect Solutions
Corporate Communications, Asia Pacific
winnie.chou@qnityelectronics.com
For Prospective Talent
At Qnity, you won’t just start a new job — you’ll help shape the future. Join a global leader making tomorrow’s technologies possible, from AI to advanced computing and beyond. Here, your ideas spark innovation, your curiosity drives progress, and your journey powers the next leap in electronics.
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.