Introduction to chemical mechanical planarization
Discover What's Next at SEMICON West 2026
Powering the Next Leap in Electronics
October 13-15, 2026 | Moscone Center | San Francisco, CA
Qnity Booth: Booth #965 – Find us in the exhibitor directory and floor plan under Qnity.
Qnity will showcase our latest innovations for semiconductor manufacturing, including the introduction of Kalrez® 7080 parts, a new high-performance sealing solution engineered for demanding thermal semiconductor processes operating at temperatures up to 330°C.
Qnity will also showcase how advances in materials, process technologies, and critical equipment components can help manufacturers achieve reliable, high-yield production for next-generation semiconductor devices and advanced packaging architectures. In addition to its Kalrez® portfolio, Qnity will highlight a range of solutions supporting advanced node semiconductor fabrication, advanced packaging, and thermal management.
Schedule a meeting | Contact our team
SEMI West 2026 TechTalk
Material Innovations for Enabling Future Computing session 1
Accelerating Innovation for the Trillion-Dollar Semiconductor Era
Speaker: Michael E. Mills, PhD. Sr. Fellow, Emerging Technologies / Pathfinding, Qnity Electronics
Date & Time: Wednesday October 14 | 11:50 AM – 12:10 PM
Location: North Hall, Lower Level room 20
Drive scaling and performance at advanced nodes with Qnity's materials and process innovations
Featured Technology: Kalrez® Sealing Solutions for Advanced Semiconductor Manufacturing
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Innovation Spotlight: New Products and Industry Recognition in Semiconductor Manufacturing
Optivision™ Max CMP pad family
Optivision™ Max CMP pad family
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Emblem™ next-generation CMP pad family – winner of 2026 Edison Award
Emblem™ next-generation CMP pad family – winner of 2026 Edison Award
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Epic® and UV™ non-fluorine photoresists
Epic® and UV™ non-fluorine photoresists
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Eon™ photoresists and AR™ underlayers – expanded offerings for EUV lithography (
Eon™ photoresists and AR™ underlayers – expanded offerings for EUV lithography (
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New PCMPSolv™ clean for ceria applications
New PCMPSolv™ clean for ceria applications
R&D 100 Award for sustainable photoresists
R&D 100 Award for sustainable photoresists
Product Literature
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Explore how Qnity’s advanced packaging materials and process capabilities power the stack
New: Stackplane™ CMP slurry platform for advanced packaging
New: Stackplane™ CMP slurry platform for advanced packaging
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Explore how Qnity's advanced packaging materials and process capabilities power next-generation semiconductor integration, AI computing, and heterogeneous packaging.
Discover innovative products and solutions that powering performance through heat management and reliability
Explore Our Thermal Content Hub
What you’ll find in the hub:
· Case studies from hyperscale data centers, optical interconnects, and wearable devices
· A white paper on gap pad recovery/rebound and thermal contact optimization
· A video overview of our thermal portfolio
· Direct links to brochures, detailed product pages, and application notes
Product Literature
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For media interviews or any media-related inquiries:
Ashley Boucher
Director, Communications
ashley.boucher@qnityelectronics.com
or
Rebekah Lazar
Director, Global Communications, Semiconductor Technologies
rebekah.lazar@qnityelectronics.com
For Prospective Talent
At Qnity, you won’t just start a new job — you’ll help shape the future. Join a global leader making tomorrow’s technologies possible, from AI to advanced computing and beyond. Here, your ideas spark innovation, your curiosity drives progress, and your journey powers the next leap in electronics.
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.