All-Polyimide Solutions

Pyralux® AC all-polyimide single-sided copper-clad laminate features an adhesiveless, all‑polyimide dielectric layer. It is ideal for single-sided flex applications that demand high‑density circuitry and chip‑on‑flex attachment. Offered with a variety of conductor types

Pyralux® AG all-polyimide double-sided copper-clad laminate features an adhesiveless, all‑polyimide dielectric layer. The material system is designed for flexible printed circuits requiring advanced material performance, excellent temperature resistance, and high reliability. Available in a range of dielectric and conductor thicknesses.  

Pyralux® AK all-polyimide double-sided copper-clad laminate composed of an all‑polyimide composite, with polyimide film bonded to copper foil. The material system is designed to deliver advanced material performance, excellent temperature resistance, and high reliability. Available in multiple dielectric and copper thicknesses. 

Pyralux® AP all-polyimide double-sided copper-clad laminate featuring an adhesiveless, all-polyimide dielectric layer. This material is ideal for multilayer flex and rigid-flex applications that require advanced performance, including low loss properties for excellent signal integrity and thermal resistance for high reliability. Available in a range of conductor and dielectric thicknesses.  

Pyralux® APR all-polyimide embedded resistor laminate features an adhesiveless, all-polyimide dielectric layer in combination with TCR® thin-film embedded resistor copper foil from Ticer Technologies. This material system is ideal for multilayer flex, rigid-flex, and rigid printed circuit board (PCB) applications which require reliable embedded resistor technology, advanced material performance, temperature resistance, high reliability, and robust processing. Offered in a wide range of dielectric thicknesses and resistance levels.

Pyralux® HT high temperature polyimide bonding film features a thermoplastic polyimide composition that is suitable for application either as a coverlay to protect surface circuitry or bond ply for multilayer flex and rigid-flex applications. This stand-alone film exhibits low loss characteristics for high performance applications. Pyralux® HT can be used in conjunction with all-polyimide Pyralux® clads to afford a robust circuitry solution for applications requiring high operating temperature performance, excellent signal integrity, and high reliability.

Pyralux® ML 715CuNi double‑sided metal‑clads are laminates featuring an alloy foil on one or both sides of Kapton® polyimide film. Available in multiple foil and dielectric thickness combinations, including balanced and unbalanced constructions, it offers designers flexibility to tailor thermal, electrical, and mechanical performance. Strong dielectric‑to‑metal bonding, excellent thermal resistance, and tight thickness tolerances support high reliability and predictable performance in demanding environments.

Pyralux® TAHS all-polyimide single-sided copper-clad laminate features an adhesiveless, all-polyimide dielectric layer. These materials exhibit excellent low loss performance, enabling remarkable signal integrity in high-speed digital and high-frequency circuit applications. Offered in a variety of both dielectric and conductor thickness.

Pyralux® TFH all-polyimide double-sided copper-clad laminate features an adhesiveless, all-polyimide dielectric layer and a copper foil optimized for minimal insertion loss. This material exhibits excellent low loss performance, enabling remarkable signal integrity in high-speed digital and high-frequency circuit applications. Offered in a variety of both dielectric and conductor thickness.

Pyralux® TFHS all-polyimide single-sided copper-clad laminate features an adhesiveless, all-polyimide dielectric layer and a copper foil optimized for minimal insertion loss. This material exhibits excellent low loss performance, enabling remarkable signal integrity in high-speed digital and high-frequency circuit applications. Offered in a variety of both dielectric and conductor thickness.

Pyralux® FR flame retardant acrylic-based coverlay features Kapton® polyimide film, coated on one side with a proprietary flame-retardant B-staged modified acrylic adhesive. This coverlay can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation.

Pyralux® FR flame retardant acrylic sheet adhesive is proprietary flame-retardant B-staged modified acrylic adhesive. This stand-alone adhesive is primarily utilized to bond flexible inner layers of multilayers, as well as bonding stiffeners and heat sinks to flexible circuits and rigid boards.

Pyralux® FR flame retardant acrylic-based copper-clad laminate features Kapton® polyimide film bonded to copper foil on one or both sides using a proprietary flame‑retardant, C‑staged modified acrylic adhesive. The laminate is available with rolled‑annealed (RA) or electrodeposited (ED) copper foil, including double‑treated copper foil to eliminate surface preparation steps prior to resist or coverlay lamination. Pyralux® FR supports balanced and unbalanced constructions and is designed to provide reliable bonding and efficient processing for flame‑retardant circuit designs.

Pyralux® FR flame retardant acrylic-based bond ply features Kapton® polyimide film, coated on both sides with a proprietary flame-retardant B-staged modified acrylic adhesive. This bond ply can be used to encapsulate etched details for environmental protection and electrical insulation. Using a bond ply can eliminate a layer of Kapton® dielectric and a layer of adhesive in low layer count multilayer constructions.

Pyralux® LF acrylic-based bond ply features Kapton® polyimide film, coated on both sides with a proprietary B-staged modified acrylic adhesive. This bond ply can be used to encapsulate etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® dielectric and a layer of adhesive in low-layer count multilayer constructions.

Pyralux® LF acrylic-based coveraly features Kapton® polyimide film, coated on one side with a proprietary B-staged modified acrylic adhesive. This coverlay can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation.

Pyralux® LF acrylic-based copper-clad laminate features Kapton® polyimide film, bonded to copper foil, on one or both sides, with a proprietary C-staged modified acrylic adhesive. These copper-clad laminates are recommended for use to produce high reliability, high density circuitry in flexible, rigid-flex, and all-flexible multilayer constructions. All copper-clad laminates are available with rolled-annealed (RA) or electrodeposited (ED) copper foil. Double-treated copper foil (nodules of electro-deposited copper on both sides of the copper foil) is also available to eliminate surface preparation steps prior to resist or coverlay lamination

DuPont™ Pyralux® LF Sheet Adhesive is proprietary B-staged modified acrylic adhesive. This stand-alone adhesive is primarily utilized to bond flexible inner layers or rigid cap layers in multilayer laminates. It is also widely used to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as bonding stiffeners and heat sinks to flexible circuits and rigid boards.

Pyralux® LF-B black acrylic-based coveraly features Kapton® matte black polyimide film for high performance applications where design aesthetics are critical. This product is coated on one side with a proprietary B-staged modified acrylic adhesive. This coverlay can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation.

Pyralux® GFL low loss sheet adhesive is a proprietary B-staged modified epoxy adhesive. This stand-alone adhesive exhibit low loss characteristics for high performance applications, while retaining excellent mechanical resilience to facilitate high-yield circuit fabrication. Pyralux® GFL is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions.

Pyralux® GPL coverlay is a halogen free coverlay. Pyralux® GPL coverlay composites are constructed of amber Kapton® polyimide film, coated on one side with adhesive. Pyralux® GPL coverlay is designed to encapsulate etched details in flexible and rigid-flex multilayer circuits, providing environmental protection and electrical insulation while delivering high performance. Compatible with Pyralux® all-polyimide laminates with excellent process yield.

Pyralux® GPL low loss sheet adhesive is a proprietary B-staged modified epoxy adhesive. This stand-alone adhesive exhibit low loss characteristics for high performance applications, while retaining excellent mechanical resilience to facilitate high-yield circuit fabrication. Pyralux® GPL is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions.

Pyralux® HP high performance epoxy adhesive demonstrating both low loss and high reliability, specifically designed for original equipment manufacturers (OEMs) and printed circuit board (PCB) design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex PCBs in military, telecommunications, automotive and medical applications.

Pyralux® HP high performance epoxy coverlay features Kapton® polyimide film and a low loss, high reliability epoxy-based adhesive, specifically designed for original equipment manufacturers (OEMs) and printed circuit board (PCB) design manufacturers. Its optimized low-loss solution is for multi-layer flex and rigid-flex PCBs in military, automotive and medical applications. Pyralux® HP coverlay provides best-in-class insertion loss performance, increased functionality and ease of processing while maintaining high reliability.

Pyralux® HXC black coverlay features Kapton® MBC matte black polyimide film, for high performance applications where design aesthetics are critical. This product is coated on one side with a proprietary B-staged modified epoxy adhesive. Pyralux® HXC can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation. Black coverlay is also commonly used to enhance circuit aesthetics and improve LED lighting controls in specialty applications.

Pyralux® TK Kapton® & fluoropolymer bond ply features Kapton® polyimide film, coated on both sides with a proprietary B-staged modified acrylic adhesive. This bond ply can be used to encapsulate etched details for environmental protection and electrical insulation. Using bond ply can eliminate a layer of Kapton® dielectric and a layer of adhesive in low-layer count multilayer constructions.

Pyralux® TK Kapton® & fluoropolymer double-sided copper-clad laminate features a proprietary layered dielectric, comprising both Kapton® polyimide film and fluoropolymer films. This unique composition affords the lowest loss performance for a Pyralux® copper-clad laminate, enabling remarkable signal integrity in high-speed digital and high frequency circuit applications. Offered with both rolled annealed (RA) and electrodeposited (ED) copper foil, Pyralux® TK can address your highest performance flex and rigid-flex applications where dielectric constant must fall below 3.0.

Interra® HK04J all-polyimide embedded capacitor laminate is designed to function as a thinner and more efficient power and ground planes in printed wiring boards (PWBs).This double-sided copper-clad laminate features an adhesive-less, all-polyimide dielectric layer that affords excellent resilience during processing and fabrication. Interra® HK04J is compatible with existing PWB processes, including double-sided processing and its thin design maximizes capacitance density, reduces inductance, and decreases board or package thickness.